Capacitorless 3D DRAM
Capacitorless indium-gallium-zinc-oxide (IGZO DRAM is a suitable candidate for realizing high-density 3D DRAM, says Imec.
This article was posted on Jan 10, 2022TUM develops spin materials for quantum computing
While conventional electronics relies on the transport of electrons, components that convey spin information alone may be many times more energy efficient.
This article was posted on Jan 10, 2022Techinsights invests for 3nm node
Techinsights, the IC reverse engineering specialists, has made significant investment in its lab technology, with the commitment to purchase the following in 2022:
This article was posted on Jan 10, 2022Xi’an lockdown could reverse memory price trend
The China government’s lockdown of the city of Xi’an could reverse the trend on memory prices which had been heading down before the Covid outbreak in the city,
This article was posted on Jan 10, 2022Huawei expects 29% drop in 2021 revenues
Huawei expects 2021 revenue of $99.48 billion, 28.9% down on 2020.
This article was posted on Jan 10, 2022Amphenol RF adds to SMP range
Amphenol RF has expanded its SMP product series with a newright‐angle cable plug designed for easier assembly andimproved performance.
This article was posted on Jan 10, 2022Mico uses Raspberry Pi Pico IC
Maker Mahesh Venkitachalam has designed a high quality microphone he calls Mico using the main component of the Raspberry Pi Pico – the RP2040 controller chip – which can be bought separately from the Pico platform.
This article was posted on Jan 10, 2022RFFE market to have 10% CAGR 2021-6
The global RF Front End (RFFE) market should reach $4.3 billion in 2026 with a 10% CAGR2021-2026, according to Yole Developpement
This article was posted on Jan 6, 2022Bug hits CES
Omicron is hitting CES with a number of tech companies pulling out of having a physical presence at the show which runs January 5-8 in Las Vegas..
This article was posted on Jan 6, 2022Leti proposes FD-SOI spin qubit platform for quantum computing
A paper from CEA-Leti called “A new FD-SOI spin qubit platform with 40nm effective control pitch”, notes that operating Si quantum dot (QD) arrays requires homogeneous and ultra-dense structures with aggressive gate pitch.
This article was posted on Jan 6, 2022Direct Insights develops BSP
Direct Insight, the Oxfordshire embedded specialist, has developed a Board Support Package (BSP) which enables the use of QNX 7 with the Boundary Devices’ Nitrogen 8M board, an ARM-based SBC designed to leverage the capabilities of NXP’s i.MX8M Mini Quad processor.
This article was posted on Jan 6, 2022UV wall protects against Covid
A research team from the Technical University of Munich and the Division of Infectious Diseases and Tropical Medicine at the LMU University Hospital Munich, in cooperation with the start-up Smart United GmbH, has developed an invisible protective “wall” made of UV-C light.
This article was posted on Jan 6, 2022OneWeb launches 36 satellites
Yesterday, OneWeb, the satellite constellation backed by the UK government and Bharti Enterprises, launched 36 satellites from the Baikonur cosmodrome in Kazakhstan.
This article was posted on Jan 6, 2022TE acquires NSR relay technology
TE Connectivity (TE) has acquired force-guided narrow safety relay (NSR) technology from the Phoenix Contact Group.
This article was posted on Jan 6, 2022First wafers for Weebit Nano
Weebit Nano has received from manufacturing the first silicon wafers that integrate its embedded ReRAM module inside complete subsystem demonstration (demo) chips.
This article was posted on Jan 6, 2022India moves to establish domestic chip industry
From January 1st, India is taking applications from chip companies to set up fabs in India.
This article was posted on Jan 6, 2022Raspberry Pi adds Trilobot
Raspberry Pi has come up with the Trilobot robot kit.
This article was posted on Jan 6, 2022HMI technology combines touch with 3D injection moulding.
Kyocera has unveiled its HAPTIVITY iHMI technology —a hybrid innovation combining touch technology with 3D injection-moulded structural electronics technology (IMSET) from TactoTek Oy.
This article was posted on Jan 5, 2022Low power system for bionic eyes
A low-power system for use in bionic eyes, has been jointly developed by academics from the Harbin Institute of Technology in China and Northumbria University.
This article was posted on Jan 5, 2022Samsung SSD incorporates PCIe 5.0
Samsung is sampling an SSD for enterprise servers, integrating the PCIe 5.0 interface with Samsung’s sixth-generation V-NAND.
This article was posted on Jan 5, 2022Lattice upgrades solution stack
Lattice has also announced the release of an updated version of the Lattice Propel embedded design environment to simplify the development of industrial automation systems with improved performance and added functionality supporting RISC-V soft processor cores.
This article was posted on Jan 5, 2022