Smartphone AP market hit $8.3bn in Q3
The global smartphone applications processor (AP) market grew 17% to $8.3 billion in Q3 2021, with Qualcomm, Apple, MediaTek , Samsung and Unisoc taking the top-five revenue share rankings.
This article was posted on Jan 11, 2022Chip sales to grow 9% in 2022
Semiconductor sales are expected to grow 9% in 2022 and cross $600 billion for the first time, says trade credit insurer Euler Hermes which expects demand to normalise in 2022.
This article was posted on Jan 11, 2022Theranos founder found guilty of fraud
Yesterday Theranos founder Elizabeth Holnes was found guilty on four counts of wire fraud and conspiracy to commit fraud against investors.
This article was posted on Jan 11, 2022Apple’s market cap hits $3trn
Yesterday, Apple became the first company to achieve a market cap of $3 trillion.
This article was posted on Jan 11, 2022Auto IC shortages to last through H1
Daimler is expecting chip shortages to last throughout 2022.
This article was posted on Jan 11, 202233W charger reference design uses silicon mosfets
Silanna Semiconductor has released a 33W charger reference design built around its SZ1131 and silicon power FETs. This follows a larger 65W design released last year.
This article was posted on Jan 11, 2022Microchip’s next-generation in-circuit emulator
Microchip Technology has announced its next-generation in-circuit emulator for its microcontrollers and microprocessor, including Atmel-created parts such as AVR and SAM.
This article was posted on Jan 11, 2022Yamaichi launches Y-SPE series
Yamaichi Electronics has brought our its Y-SPE, a series of connectors for Industrial Single Pair Ethernet (SPE) according to IEC 63171.
This article was posted on Jan 10, 2022DDS signal generation Click module
MikroElektronika (MIKROE) has launched Waveform 4 Click – a member of its +1000-strong Click family of peripheral development boards – that operates as a signal generator for high-speed, high-dynamic-range, multichannel complex waveforms.
This article was posted on Jan 10, 2022Intel reported to be applying for Indian manufacturing incentives
One of the companies said to be preparing to apply for government incentives to set up IC manufacturing in India is Intel, reports The India Express.
This article was posted on Jan 10, 2022Capacitorless 3D DRAM
Capacitorless indium-gallium-zinc-oxide (IGZO DRAM is a suitable candidate for realizing high-density 3D DRAM, says Imec.
This article was posted on Jan 10, 2022TUM develops spin materials for quantum computing
While conventional electronics relies on the transport of electrons, components that convey spin information alone may be many times more energy efficient.
This article was posted on Jan 10, 2022Techinsights invests for 3nm node
Techinsights, the IC reverse engineering specialists, has made significant investment in its lab technology, with the commitment to purchase the following in 2022:
This article was posted on Jan 10, 2022Xi’an lockdown could reverse memory price trend
The China government’s lockdown of the city of Xi’an could reverse the trend on memory prices which had been heading down before the Covid outbreak in the city,
This article was posted on Jan 10, 2022Huawei expects 29% drop in 2021 revenues
Huawei expects 2021 revenue of $99.48 billion, 28.9% down on 2020.
This article was posted on Jan 10, 2022Amphenol RF adds to SMP range
Amphenol RF has expanded its SMP product series with a newright‐angle cable plug designed for easier assembly andimproved performance.
This article was posted on Jan 10, 2022Mico uses Raspberry Pi Pico IC
Maker Mahesh Venkitachalam has designed a high quality microphone he calls Mico using the main component of the Raspberry Pi Pico – the RP2040 controller chip – which can be bought separately from the Pico platform.
This article was posted on Jan 10, 2022RFFE market to have 10% CAGR 2021-6
The global RF Front End (RFFE) market should reach $4.3 billion in 2026 with a 10% CAGR2021-2026, according to Yole Developpement
This article was posted on Jan 6, 2022Bug hits CES
Omicron is hitting CES with a number of tech companies pulling out of having a physical presence at the show which runs January 5-8 in Las Vegas..
This article was posted on Jan 6, 2022Leti proposes FD-SOI spin qubit platform for quantum computing
A paper from CEA-Leti called “A new FD-SOI spin qubit platform with 40nm effective control pitch”, notes that operating Si quantum dot (QD) arrays requires homogeneous and ultra-dense structures with aggressive gate pitch.
This article was posted on Jan 6, 2022Direct Insights develops BSP
Direct Insight, the Oxfordshire embedded specialist, has developed a Board Support Package (BSP) which enables the use of QNX 7 with the Boundary Devices’ Nitrogen 8M board, an ARM-based SBC designed to leverage the capabilities of NXP’s i.MX8M Mini Quad processor.
This article was posted on Jan 6, 2022