All-metal 1W current sense resistor in 0805

Stackpole Electronics is pitching its 1W-rated CSSH0805 all-metal 0805-size chip resistor family against 1206 and 2010 parts for current sensing.

This article was posted on Sep 1, 2021

Chip industry must double capacity in a decade, says GloFo CEO

The semiconductor industry needs to double its capacity in the next 8-10 years to meet demand, says Globalfoundries CEO Tom Caufield.

This article was posted on Aug 31, 2021

BYD IPO scuppered by China regulator

BYD Semiconductor, the chip-making subsidiary of Chinese EV manufacturer BYD, has been forced to postpone its IPO by a regulatory intervention.

This article was posted on Aug 31, 2021

IBM launches Telum

At Hot Chips, today, IBM showed its Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time .

This article was posted on Aug 31, 2021

Schaffner extends filter series

Schaffner, the electromagnetic compatibility specialist, has extended its FN3270 series to provide more options for machine builders.

This article was posted on Aug 31, 2021

Richardson RFPD supporting ADI front ends

Richardson RFPD is offering availability and full design support for two high-speed converters from Analog Devices.

This article was posted on Aug 31, 2021

BAE Systems furthers defence collaboration with Intel

BAE Systems has announced another strategic business agreement for its FAST Labs R&D organisation having early access to selected Intel technologies.

This article was posted on Aug 31, 2021

Q3 DRAM ASPs to grow more slowly

DRAM ASP for Q3 is forecast by TrendForce to grow 3-8% q-o-q after a stonking 26% rise in Q2 revenues pushed sales to $24.1 billion.

This article was posted on Aug 31, 2021

Samsung HBM-PIM AI accelerator converges logic and memory

At Hot Chips, Samsung showed processing-in-memory (PIM) technology with High Bandwidth Memory (HBM) integrated into an accelerator.

This article was posted on Aug 31, 2021

US DoD contracts for Intel 18A foundry process

Intel has picked up the US Department of Defence as a customer for its new foundry service operation.

This article was posted on Aug 31, 2021

Farnell signs Epishine

Epishine’s printed organic solar cells are optimised for harvesting energy from indoor, low energy lighting enabling organic solar power to be used everywhere.

This article was posted on Aug 31, 2021

Cardboard boxes are greener than plastic alternatives?

Carton packaging for small electrical goods has a lower carbon footprint than plastic alternatives, according to Pro Carton, the European association for carton and cartonboard manufacturers, which is highlighting a report written by the bio-economy unit of the Research Institutes of Sweden (RISE).

This article was posted on Aug 30, 2021

Nvidia-Arm merger would substantially lessen competition says U.K. government report

An Arm-Nvidia merger would involve a Substantial Lessening Of Competition (SLC) concludes the Competition and Markets Authority (CMA) in its Phase One review of the proposed merger for the Department Of Culture Media and Sport (DCMS).

This article was posted on Aug 30, 2021

Redwire highlights HOSS (Hyperion Operational Space Simulation Laboratory)

Redwire, the Jacksonville, Florida-based space infrastructure company, has unveiled its Hyperion Operational Space Simulation Laboratory (HOSS), which it describes as “a first-of-its-kind digital engineering environment”.

This article was posted on Aug 30, 2021

Researchers ‘at the threshold’ of fusion ignition

An experiment at Lawrence Livermore National Laboratory’s (LLNL’s) National Ignition Facility(NIF) made a significant step toward ignition, achieving a yield of more than 1.3 megajoules (MJ).

This article was posted on Aug 30, 2021

Automated disassembly for car batteries

Researchers at the Department of Energy’s Oak Ridge National Laboratory have developed a robotic disassembly system for spent electric vehicle battery packs to safely and efficiently recycle and reuse critical materials while reducing toxic waste.

This article was posted on Aug 30, 2021

7.5% CAGR 2020-26 for IGBTs

The IGBT market is set to grow at a 7.5% CAGR 2020-26 to reach $8.4 billion by 2026, says Yole Developpement, with the IGBT modules segment to represent 81% of the total market in 2026 boosted by EV/HEVs adoption.

This article was posted on Aug 30, 2021

Intel looking to be a consolidator

Intel is looking to be an industry consolidator.

This article was posted on Aug 30, 2021

Auto chip shortage to end in Q4

Taiwan’s Economy Minister Wang Mei-hua says that auto chip shortages should be over by Q4.

This article was posted on Aug 30, 2021

Dewesoft updates data acquisition software Word reporting link, and more

Upgrades to linked processing markers, Microsoft Word reporting and J1939 multi-frame support are amongst the improvements in version 2021.4 of DewesoftX, the software that runs alongside Dewesoft’s data acquisition hardware.

This article was posted on Aug 30, 2021

Wash-down proof stainless steel enclosures

Tough and clean environments are the target for stainless steel lockable solid door enclosures made by Hylec and now offered by BCL Enclosures.

This article was posted on Aug 30, 2021