Sony Semi joins Si Catalyst
Sony has become the ninth Strategic Partner of Silicon Catalyst.
This article was posted on Dec 6, 2021More on: Tesla’s AI supercomputer
Tesla revealed its plans for a 1.1Eflop artificial intelligence supercomputer late last week, built around an 7nm in-house-developed IC with 354 custom processors delivering 362Tflop of processing and 16Tbit/s of IO bandwidth.
This article was posted on Sep 1, 2021ST adds to GaN portfolio
Easing the transition to high-efficiency wide-bandgap technology, ST has released the MasterGaN3 and MasterGaN5 integrated power packages for applications up to 45W and 150W, respectively.
This article was posted on Sep 1, 2021iSpace announces its next-gen larger lunar lander
iSpace – the lunar space transportation company based in Tokyo – has unveiled its next generation lunar lander, dubbed Series 2. It will first be used for the company’s third lunar mission.
This article was posted on Sep 1, 2021Rockley adds BEOL processing to Skywater foundry contract
Skywater, the Minnesota foundry, will undertake BEOL processing for Rockley Photonics’ spectrophotometer-on-a-chip health monitoring product.
This article was posted on Sep 1, 2021Transfer Learning vs Incremental Learning for training neural nets
Brainchip, the AI processor specialist, has looked whether transfer learning is more efficient than incremental learning in training neural nets to perform AI/ML tasks..
This article was posted on Sep 1, 2021Compact i.MX 8M Plus AI edge computers
Advantech has released a series of small AI-native computers built around NXP’s i.MX 8M Plus processors.
This article was posted on Sep 1, 2021Transfer Learning vs Incremental Learning for training neural nets
Brainchip, the AI processor specialist, has looked whether transfer learning is more efficient than incremental learning in training neural nets to perform AI/ML tasks..
This article was posted on Sep 1, 2021Compact i.MX 8M Plus AI edge computers
Advantech has released a series of small AI-native computers built around NXP’s i.MX 8M Plus processors.
This article was posted on Sep 1, 2021Novel antenna combines a dish and a phased array
Lockheed Martin has created a novel millimetre-wave dish antenna for satellites and ground terminals, particularly for space-based 5G communication.
This article was posted on Sep 1, 2021All-metal 1W current sense resistor in 0805
Stackpole Electronics is pitching its 1W-rated CSSH0805 all-metal 0805-size chip resistor family against 1206 and 2010 parts for current sensing.
This article was posted on Sep 1, 2021Chip industry must double capacity in a decade, says GloFo CEO
The semiconductor industry needs to double its capacity in the next 8-10 years to meet demand, says Globalfoundries CEO Tom Caufield.
This article was posted on Aug 31, 2021BYD IPO scuppered by China regulator
BYD Semiconductor, the chip-making subsidiary of Chinese EV manufacturer BYD, has been forced to postpone its IPO by a regulatory intervention.
This article was posted on Aug 31, 2021IBM launches Telum
At Hot Chips, today, IBM showed its Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time .
This article was posted on Aug 31, 2021Schaffner extends filter series
Schaffner, the electromagnetic compatibility specialist, has extended its FN3270 series to provide more options for machine builders.
This article was posted on Aug 31, 2021Richardson RFPD supporting ADI front ends
Richardson RFPD is offering availability and full design support for two high-speed converters from Analog Devices.
This article was posted on Aug 31, 2021BAE Systems furthers defence collaboration with Intel
BAE Systems has announced another strategic business agreement for its FAST Labs R&D organisation having early access to selected Intel technologies.
This article was posted on Aug 31, 2021Q3 DRAM ASPs to grow more slowly
DRAM ASP for Q3 is forecast by TrendForce to grow 3-8% q-o-q after a stonking 26% rise in Q2 revenues pushed sales to $24.1 billion.
This article was posted on Aug 31, 2021Samsung HBM-PIM AI accelerator converges logic and memory
At Hot Chips, Samsung showed processing-in-memory (PIM) technology with High Bandwidth Memory (HBM) integrated into an accelerator.
This article was posted on Aug 31, 2021US DoD contracts for Intel 18A foundry process
Intel has picked up the US Department of Defence as a customer for its new foundry service operation.
This article was posted on Aug 31, 2021Farnell signs Epishine
Epishine’s printed organic solar cells are optimised for harvesting energy from indoor, low energy lighting enabling organic solar power to be used everywhere.
This article was posted on Aug 31, 2021