Hall-effect current-sensing IC
Melexis has introduced the MLX91211 Hall-effect current-sensing IC.
This article was posted on Nov 26, 2020Russian scientists crack Mendeleev mystery
Russian scientists have created a chemical space mapping method and cracked the mystery of Mendeleev Numbers.
This article was posted on Nov 26, 2020Electronica: Infineon focuses on sensors
Tomorrow, at the virtual Electronica, Infineon will be focusing on sensors with an emphasis on smart buildings and consumer life.
This article was posted on Nov 26, 2020Graphcore reported to be raising another $200m
Graphcore is reported by Bloomberg to be raising about $200 million which would take the company’s total funding to around $660 million.
This article was posted on Nov 26, 2020Infineon forecasts €10.5bn 2021
Infineon had calendar Q3 (financial Q4) revenue of €2,490 million for a profit of €379 million and a net margin of 15.2%.
This article was posted on Nov 26, 2020DIY hearing aid for the many costs just a few dollars
From Georgia Tech has emerged a hearing aid design that can be built for a few dollars from easily obtained parts.
This article was posted on Nov 26, 2020Koreans unhappy with 5G performance
Koreans are unhappy with 5G performance and are switching back to 4G, reports the Nikkei.
This article was posted on Nov 26, 2020400W medical PSU gets seven output options from 12V to 48V
TDK has added a wider choice of output voltages to its CUS400M range of 400Wmax medical power supplies, originally only available in 12V or 24V.
This article was posted on Nov 25, 2020Network software for Tessent TestKompress simplifies DFT flow
To meet the increasing size of ICs, required to accommodate the integration of billions of transistors in order to deliver the performance required for tasks such as AI and autonomous vehicles, Mentor has announced Tessent Streaming Scan Network software for its Tessent TestKompress scan test tool. The larger IC design sizes and increased complexity has led to a rise in the time and cost required for test as well as planning design for test (DFT) structures and functionalities.
This article was posted on Nov 25, 2020External fan saves space inside equipment racks
Pfannenberg has created a series of external fans to save space inside equipment racks.
This article was posted on Nov 25, 20203D printed EMC shielding and radar absorber
Hexcel has launched an electrically-conductive high-performance thermoplastic for 3D printing using selective laser sintering (SLS). Applications in EMC shielding, static dissipation and radar absorption are foreseen.
This article was posted on Nov 25, 2020GloFo signs RF-SOI wafer supply deal with Soitec
Globalfoundries has signed a multi-year supply deal for RF-SOI wafers with Soitec.
This article was posted on Nov 25, 2020Record 300mm fab spend in 2020
300mm fab investments in 2020 will grow by 13% y-o-y to eclipse the previous record high set in 2018, says SEMI.
This article was posted on Nov 25, 2020Face recognition on an MCU
NXP has announced its latest NXP EdgeReady IoT solution for secure face recognition that enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively add vision-based touchless access control. NXP’s turnkey solution includes the i.MX RT106F crossover MCU and license to AI/ML-based face recognition software, which makes possible face recognition with liveness checking using infrared and RGB cameras, flash and SDRAM memories at a total cost lower than $10.
This article was posted on Nov 25, 2020Qorvo gets US government contract to build advanced packaging centre
Qorvo has been selected by the US government to create a State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center.
This article was posted on Nov 25, 2020Ayar Labs raises $35m Series B
Ayar Labs, the optical interconnect specialist, has completed a $35 million Series B financing co-led by Downing Ventures and BlueSky Capital.
This article was posted on Nov 25, 2020Two dimensional semiconductor shows logic-in-memory promise
Molybdenum disulphide two-dimensional semiconductor memory transistors are possible, and might be used to build logic-in-memory processors using a fabrication process that can be scaled, according to the Laboratory of Nanoscale Electronics and Structures (LANES) at Swiss lab EPFL, which has built a chip around floating-gate fets, similar to those used in flash memory.
This article was posted on Nov 25, 2020Cooling camera components
Imaging sensors and other sensitive camera components such as FPGA’s require active cooling to keep operating temperatures below their maximum limit, ensuring high-quality image resolution.
This article was posted on Nov 24, 2020UK Space Agency wins sustainable development award for IPP
The UK Space Agency has itself won a global award for sustainable development: the GEO (Group on Earth Observations) Sustainable Development Goals (SDGs) Award.
This article was posted on Nov 24, 2020Palantir in talks to provide UK contact tracing services
Palantir, the Peter Thiel-founded Californian data mining company, is in talks with the UK government to provide a contact tracing system, reports the FT.
This article was posted on Nov 24, 2020Advanced packaging to have 31% CAGR 2019-25
The high-end packaging market will reach more than $4 billion by 2025 with a 31% CAGR between 2019 and 2025, says Yole Développement.
This article was posted on Nov 24, 2020