More on: Isolated ADCs measure mV with a ±200V offset
Texas Instruments is aiming at robot motor control up to 60V with a series of isolated ADCs that include 200V barriers and come in 8pad 3.5 x 2.7mm VSON packaging.
This article was posted on Apr 8, 2025Embedded World Video: AMD driving the future of automotive
At Embedded World 2025 we caught up with Wayne Lyons, senior marketing director of the automotive business at AMD, as part of our promotional coverage for the event.
This article was posted on Apr 8, 2025Embedded World Video: Introducing the AMD EPYC Embedded 9005 Processor
At Embedded World 2025 we caught up with Sumit Shah, Head of Product Management and Marketing at AMD, as part of our promotional coverage for the event
This article was posted on Apr 8, 20251.5mΩ 48V automotive load switch
Infineon has revealed a 1.5mΩ protected load switch for 24V and 48V automotive systems.
This article was posted on Apr 8, 2025Imec launches Stuttgart advanced chip design accelerator
Belgian research lab Imec has launched a chip design accelerator with the State Government of Baden-Württemberg.
This article was posted on Apr 8, 2025EW BrightSparks 2024 profile: Nathan Richardson, Surrey University
Now in its seventh year of awards, EW BrightSparks sees Electronics Weekly highlight and celebrate some of the brightest and most talented young engineers in the UK today.
This article was posted on Apr 8, 2025Defence demand drives IR image sensor market to 5% CAGR 2024-30
Defence demand drove the infrared image sensor market to more than $1 billion in 2024, says Yole Group. 2024-30 CAGR will be more than 5%.
This article was posted on Apr 8, 2025Bellezza process could replace copper with graphene in ICs
Anthony Paul Bellezza (pictured) is the inventor of a 2D graphene fusion process being used for CMOS chip assembly processes that fuses interconnects at temperatures within the thermal budget of the chip below 400°C, and can work at temperatures as low as 200°C.
This article was posted on Apr 8, 2025Embedded World: 60MHz 125sample/s software-defined scope and sig-gen
Red Pitaya has upgraded its Stemlab 125-14 four-channel 60Mz software-defined test instrument.
This article was posted on Mar 21, 2025Embedded World: Heatpipe cooling for COM-HPC computer modules
Pushing back against ever hotter computer-on-modules, Congatec is offering heat-pipe based heatsinking, using acetone as a working fluid to accommodate sub-0°C switch-ons – operation is over -40 to +85°C.
This article was posted on Mar 21, 2025Viewpoint: Could novel cooling technologies unlock the hidden potential of domestic batteries?
What role could emerging cooling technologies play in making li-ion batteries more efficient? ask two specialists at Withers & Rogers.
This article was posted on Mar 21, 2025Highly integrated dynamic IoT node in 9x9x1mm package
Insight SIP, the specialist in ultra-miniature RF modules, is launching the ISP2554-HM module. This module represents a dynamic IOT node, with support for Bluetooth Low Energy, Thread, and Zigbee radios and high-performance computing including an ability to run AI at the Edge.
This article was posted on Mar 21, 2025Imec and ASML sign five year R&D agreement
ASML and imec have signed a new strategic partnership agreement, focusing on research and sustainability.
This article was posted on Mar 21, 2025Lip-Bu Tan is Intel CEO
Lip-Bu Tan (pictured) is to be the CEO of Intel from March 18th
This article was posted on Mar 21, 2025Gilmour Space’s Australian orbital rocket launch clears last hurdle
Gilmour Space Technologies has cleared the last regulatory hurdle before an Australian launch, receiving final airspace approvals from the country’s Civil Aviation Safety Authority (CASA) and Airservices Australia.
This article was posted on Mar 21, 2025JEDEC, OCP design kits progress automated SiP design using chiplets
JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test.
This article was posted on Mar 21, 2025PAVE360 SDV tech available on AMD CPUs and GPUs on Azure
Siemens Digital Industries Software announced has expanded the cloud platforms of choice available for systems-of-systems development with its PAVE360 technology for Software Defined Vehicle (SDV) development which is now available on AMD Radeon PRO V710 GPUs and AMD EPYC CPUs running on Azure.
This article was posted on Mar 21, 2025Embedded World: AI MCU gets Cortex-M55 core and Ethos-U55 NPU
Synaptics announced an AI MCU at Embedded World today, based around Arm’s Ethos-U55 NPU (neural processing unit) and Cortex-M55 CPU, plus a low-power Cortex-M4 CPU and Synaptic’s in-house mini-NPU.
This article was posted on Mar 18, 2025UK Space Agency awards SatixFy £1.8m for LEO payload software
The UK Space Agency has awarded a contract worth £1.8 million to SatixFy to develop a software suite for digital satellite payloads.
This article was posted on Mar 18, 2025Q4 good for advanced foundry nodes; bad for mature nodes
Advanced foundry process nodes had 10% q-o-q Q4 growth with demand from AI servers, smartphone processors and PCs driving the top ten foundries to revenues of $38.48 billion.
This article was posted on Mar 18, 2025Cryptographic accelerators for MCUs
ST has introduced hardware cryptographic accelerators and associated software libraries for general-purpose and secure MCUs.
This article was posted on Mar 18, 2025