Integrated HBM2E interface
Rambus has announced an interface for HBM2E memory consisting of co-verified PHY and memory controller.
This article was posted on Mar 11, 2020Oscillators on 48 hour lead-time
SiTime has 48-hour availability for MEMS oscillators.
This article was posted on Mar 11, 2020ISSCC: GaN power chip integrates control
A monolithic GaN mains power converter IC was the target of Leibniz University Hannover, which worked with Texas Instruments. And the result is a 15W off-line PSU that can feed a 30-60V LED string with 140‑190mA from 60-400V AC or DC. Efficiency is 95.6% at low input voltage, and not dropping below 87.8% all the way to 400V.
This article was posted on Mar 11, 2020ISSCC: Analogue on-chip LDO beats back digital onslaught
While digital on-die point-of-load converters are trending, analogue designs are far from finished. Digital low-dropout (DLDO) regulators appeared a few years ago and looked to be the future for on‑die point‑of‑load regulators on digital chips (see ISSCC 2020 DLDOs further down).
This article was posted on Mar 11, 2020ISSCC: Computational imaging by THz array
Researchers from the University of Wuppertal in Germany have created a THz signal source array for computational imaging, which allows a single-pixel camera – one THz receiver – to form images. This type of computational imaging involves bathing the object to be photographed in varying light fields and measuring the amplitude of light that passes by.
This article was posted on Mar 11, 2020Plextek RFI sold to CML
Cambridge-based Plextek Group has sold one of its spin-outs, the boutique microwave chip design business Plextek RFI to CML for an undisclosed sum.
This article was posted on Mar 11, 2020ISSCC: Secure chip will not make a mistake in your lifetime, probably
Working toward automotive security, Samsung has produced a ‘physically unclonable function’ (PUF) for secure crypto key generation. PUFs are blocks within chips whose characteristics only manifest when powered. They are inherently and unpredictably randomised by process variation as they are made, in a way that makes each chip uncontrollably unique, but once manufactured the characteristic is reliably invariant.
This article was posted on Mar 11, 2020ST takes control of Exagan
ST has signed an agreement to acquire a majority stake in French GaN specialist Exagan.
This article was posted on Mar 11, 2020Pole-mounted server is sealed to IP65
Supermicro introduced a sealed pole-mounted server for 5G and ‘intelligent edge’ applications at Embedded World last week.
This article was posted on Mar 10, 2020Element14 Learning Circuit video series covers BBC micro:bit
Element14, Farnell’s online community dedicated to engineering discussion and education, is supplementing classroom-based STEM with a free series of videos entitled ‘The Learning Circuit’.
This article was posted on Mar 10, 2020SmartNIC combines storage, networking, compute and acceleration
Xilinx has brought out a product which combines networking, storage, acceleration and compute functions on a single device called a SmartNIC
This article was posted on Mar 10, 2020What Happened With SARS?
With Coronavirus causing concern, we thought it might be instructive to see how the industry was affected by SARS back in 2003.
This article was posted on Mar 10, 2020Beware of IoT connected cameras, says NCSC
The National Cyber Security Centre (NCSC) is advising caution with internet connected cameras.
This article was posted on Mar 10, 2020FTTP for Welsh village
Sixty homes in the Monmouthshire village of Llanddewi Rhydderch can now have Full Fibre to the Premise (FTTP), able to receive Ultrafast Broadband, with a choice of speeds from 100Mbps to 1Gbps – a huge technological leap forward for this ‘once forgotten’ village where speeds of less than 1Mbps were the norm.
This article was posted on Mar 10, 2020Farnell tracks AI adoption in the IoT
Farnell has published research on the IoT which confirms strong adoption of AI within IoT devices, alongside new insights on key markets, enablers and concerns for design engineers working in IoT.
This article was posted on Mar 10, 2020FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs with Built-in Type-C/PD Controllers
FTDI Chip’s latest series of multi-channel USB interface ICs have the capacity to deal with next generation power requirements, as larger items of hardware start to make use of the protocol.
This article was posted on Mar 10, 2020Yangtze Memory struggling with staff shortages
At Yangtze Memory, which is making 64-layer 3D NAND, employees are still away from work, reports the Nikkei.
This article was posted on Mar 10, 2020Marvell and Samsung collaborate on 5G infrastructure products
Marvell and Samsung are extending their collaboration to encompass infrastructure across additional segments of the radio access network (RAN).
This article was posted on Mar 10, 2020Digital isolator qualified to Grade 0 AEC ambient operating temperature
The ISO7741E-Q1 features a 1.5-kVRMS working voltage and supports temperatures up to the Grade 0 maximum of 150°C.
This article was posted on Mar 9, 2020High-end inertial sensors becoming a significant market
High-end inertial sensors are becoming a significant market, says Yole Developpement
This article was posted on Mar 9, 2020Purdue licensing paper-based coronavirus detector
Researchers from Purdue University’s biomedical engineering school have developed a handheld paper device that quickly and accurately detects coronavirus MERS-CoV and could be used to detect COVID-19.
This article was posted on Mar 9, 2020