Quub, a US-based 3D printing microsatellite company, is launching an office in the UK for its Earth Observation business.
This article was posted on Oct 17, 2023The locations for semiconductor foundry manufacturing will shift over the next few years with China doing more, Taiwan less and the US increasing its share of advanced node manufacturing, says IDC’s report: The Impact of Geopolitics on Asia’s Semiconductor Supply Chain: Trends and Strategies,
This article was posted on Oct 17, 2023A team of researchers from IDLab, an imec research group at Ghent University, Belgium, has presented an optical receiver achieving a gross data rate of 200 Gbps.
This article was posted on Oct 17, 2023Raspberry Pi is ready to float, says CEO Eben Upton, who is looking to IPO the company on the London Stock Exchange.
This article was posted on Oct 17, 2023For Nvidia Jetson Orin system-on-modules, E-con Systems has created a rugged waterproof camera aimed at autonomous mobility applications such as delivery robots and agriculture vehicles.
This article was posted on Oct 17, 2023Ideal Power is aiming to compete with smart IGBT modules, with a 1.2kV 160A (100°C, 240A at 25°C) power module built around its novel ‘B-Tran’ bi-direction semiconductor switch.
This article was posted on Oct 17, 2023Solar cells tend to work better with an anti-reflection coating, and perovskite solar cells are no exception.
This article was posted on Oct 17, 2023Korean engineers and scientists have developed a soft gripper that can be used to lift 100kg, while weighing only 130g.
This article was posted on Oct 17, 2023Avnet Abacus and XP Power have signed a distribution deal for EMEA.
This article was posted on Oct 12, 2023OpenLight, the Photonics ASIC (PASIC) specialist has partnered with Spark Photonics, the photonics design services firm.
This article was posted on Oct 12, 2023Open Cosmos, the UK space tech data specialist, and the European Space Agency (ESA) have announced plans for the launch of the MANTIS satellite aboard the upcoming SpaceX Transporter-9 mission.
This article was posted on Oct 12, 2023Nexperia has teamed up with Kyocera AVX to develop an industrial 650V 20A silicon carbide rectifier module.
This article was posted on Oct 12, 2023Kontron has released an ATX server-class motherboard designed to bring Intel’s 4th and 5th generation Xeon scalable processors to embedded applications.
This article was posted on Oct 12, 2023Electronics Weekly has extended the deadline for entries to EW BrightSparks 2023 – our awards to celebrate the achievements of young engineers – for two more weeks.
This article was posted on Oct 12, 2023Cornell Dubilier Electronics is aiming at harsh environments with a series of X2, EMI-RFI suppression capacitors.
This article was posted on Oct 12, 2023XCAM, the Northampton-based imaging specialist, has secured a £200,000 grant from the UK Space Agency’s (UKSA) Centre for Earth Observation Instrumentation (CEOI).
This article was posted on Oct 12, 2023UC Davis researchers have developed a proof-of-concept sensor that may usher in a new era for millimetre wave radars.
This article was posted on Oct 12, 2023Infineon has bought the Zurich-based UWB startup 3db Access (3db).
This article was posted on Oct 12, 20235.55 million vehicles were sold in August – up almost 1% on July – says TrendForce.
This article was posted on Oct 10, 2023Binder, the industrial connector specialist, has created a new power bayonet connector, the PBC15.
This article was posted on Oct 10, 2023Last week Intel started using EUV in volume manufacturing for the first time. Fab34 in Leixlip near Dublin is the first Intel volume fab to use the Intel 4 EUV-based process which was developed in Intel’s Oregon development fab. The Leixlip fab has seven EUV machines.
This article was posted on Oct 10, 2023