Stackpole is offering 0.01% 2ppm/°C precision surface-mount resistors in sizes from 0402 to 2512 (1 x 0.5mm to 6.3 x 3.1mm).
This article was posted on Jun 28, 2023Toshiba has lunched a series of 600V super-junction mosfets with one that achieves 55mΩ in a 10 x 12 x 2.3mm TOLL package.
This article was posted on Jun 28, 2023Current sensor maker LEM now has French national approval for its DCBM 400/600 electric vehicle rapid charger billing meter.
This article was posted on Jun 28, 2023As preparation for a commercial launch, Skyrora has 3D printed a new model of its orbital rocket engine ready for landmark tests.
This article was posted on Jun 28, 2023Cambridge GaN Devices (CGD). the GaN-based power IC soecialist, has signed a distribution deal with DigiKey.
This article was posted on Jun 28, 2023ST and Airbus are to cooperate on the R&D of more efficient and lighter power electronics for hybrid-powered aircraft and full-electric urban air vehicles.
This article was posted on Jun 28, 2023Yesterday Cisco said that its SiliconOne series networking ICs are being evaluated by five of the six major cloud providers.
This article was posted on Jun 28, 2023Omron is aiming at electric vehicle chargers and solar photovoltaic installations by adding a low contact resistance model to its two-pole single-throw G7L-2A-X series of PCB-mount relays.
This article was posted on Jun 28, 2023CUI Devices has signed a distribution agreement with RS Components.
This article was posted on Jun 28, 2023Nexperia has added an 8x8mm package option, and a second 5x6mm option, to its ‘NextPower’ mosfet range which is designed to decrease spiking when switching to reduce EMI.
This article was posted on Jun 28, 2023Hard on the heels of Intel’s announcements last week of a revived €20 billion two-fab deal in Germany and a €4.6 billion assembly and test plant in Poland, comes a $25 billion fab investment in Israel.
This article was posted on Jun 27, 2023Motor inverter maker Vitesco Technologies has signed a silicon carbide component supply deal with Rohm “worth over one billion US dollars until 2030”, according to the companies.
This article was posted on Jun 27, 2023Samsung is set to extended its ‘Self-Repair’ programme for phones to Europe, having launched it in the US last year and recently taken it to Korea.
This article was posted on Jun 27, 2023Intel is to team up with French lab CEA-Leti to put two-dimensional transition-metal dichalcogenides on 300mm wafers.
This article was posted on Jun 27, 2023Persuading lithium-sulphur batteries to heal themselves is the aim of a European project which includes two UK institutions.
This article was posted on Jun 27, 2023pSemi, the Murata subsidiary, is sampling two multi-chip modules featuring dual-channel switches, the PE53230 for 3.3–3.8 GHz and the PE53231 for 3.5–4.0 GHz. Production is scheduled for Q1 2024.
This article was posted on Jun 27, 20232023 PC and Tablet shipments are expected to be 15.2% down y-o-y at 384,4 million units, says IDC.
This article was posted on Jun 27, 2023Kuva Space, a Finnish Earth observation company, has won a five-year contract worth €5m to be the sole provider of hyperspectral data services for the European Commission’s Copernicus Contributing Missions program.
This article was posted on Jun 27, 2023Guerrilla RF has brought out a series of ¼ W linear InGa HBT power amplifiers for 5G infrastructure.
This article was posted on Jun 27, 2023The emerging substrates market including GaSb, InSb, bulk GaN, Ga2O3, bulk AlN, and diamond, as well as engineered substrates and templates, valued at $63.6 million in 2022, is expected to grow at a CAGR of 27% from 2022-28 to reach $264 million by 2028, says Yole Developpement.
This article was posted on Jun 27, 2023Today, Nanusens, the Paignton supplier of MEMS sensors built inside CMOS, is finalising a Crowdcube fundraise to provide the funds to port its technology to a range of smaller process nodes.
This article was posted on Jun 26, 2023