Canon launches back-end i-line stepper for 3D packaging
Canon has brought out a back-end process semiconductor lithography i-line stepper system for 3D packaging technologies with a 0.8 µm resolution and an exposure field of 100 mm x 100 mm.
This article was posted on Jan 9, 2023US Patent Office reduces costs for small organisations
To reduce the cost for small organisations of filing for patents in the US, President Biden passed a law last week which fincreased the small entity discounts from 50% to 60% and micro entity discounts from 75% to 80%.
This article was posted on Jan 9, 2023AI looks for sleepy drivers
Artificial intelligence computer vision company Seeing Machines has teamed up with Analog Devices to create an in-vehicle driver fatigue and driver distraction monitoring system.
This article was posted on Jan 9, 2023TSMC in talks to build fab in Dresden
TSMC is talking to suppliers about the possibility of putting a fab in Dresden, reports the Nikkei.
This article was posted on Jan 6, 2023ST enhances digital power controller
ST’s STNRG011A digital power combination controller for 90W to 300W power supplies features enhanced overload management that ensures accurate output-voltage regulation when overcurrent protection is active.
This article was posted on Jan 6, 2023Imec enables tight standard cell boundary scaling using a two-level semi-damascene integration scheme
Imec has presented a semi-damascene integration approach for implementing the vertical-horizontal-vertical (VHV) scaling booster – intended to enable 4-track (4T) standard cells.
This article was posted on Jan 6, 2023Murata seeks partners to develop applications for new conductive, transparent, flexible material
Murata is looking for partners to develop applications for a new material which combines transparency, flexibility and conductivity which it calls Transparent and Bendable Conductive Film..
This article was posted on Jan 6, 2023Tyndall joins Silicon Catalyst
Tyndall National Institute, based at University College Cork, is joining Silicon Catalyst as an In-Kind Partner.
This article was posted on Jan 6, 2023TSMC holds 3nm ceremony
Tomorrow, Thursday 29th, TSMC will hold a ceremony to celebrate achieving volume production on 3nm, reports Focus Taiwan.
This article was posted on Jan 6, 2023Samsung goes for market share
Samsung will add to DRAM capacity at its main Pyeongtaek fab next year, reports the Seoul Economic Daily.
This article was posted on Jan 6, 2023NAND bit growth under 30% y-o-y 2022-5
Between 2022 and 2025, the YoY growth rate of NAND bits will remain below 30%, says TrendForce.
This article was posted on Jan 6, 2023Kyocera doubling its investment budget 2022-6
Kyocera is more than doubling its capex and R&D budget to $9.78 billion over the three years March 2022-26, Kyocera’s President Hideo Tanimoto told the Nikkei.
This article was posted on Jan 6, 2023Infineon on the acquisition trail
Infineon is looking at buying companies, according to CEO Jochen Hanebeck (pictured) speaking to the Frankfurter Allgemeine Zeitung (FAZ) newspaper.
This article was posted on Jan 6, 2023EEL market to reach $7.4bn in 2007
The market for edge-emitting lasers (EELs) will grow to $7.4 billion by 2027 from $3.5 billion last year, says Yole Developpement.
This article was posted on Jan 5, 2023Save Thermopolis
Farnell has introduced a six-week winter sales initiative that challenges participants to save “Thermopolis”, a virtual city that is no longer able to manage its resources, running the risk of compromising its sustainability.
This article was posted on Jan 5, 2023CAA issues Virgin Orbit licences ahead of UK space launch
The UK space regulator, the Civil Aviation Authority (CAA), has given its go ahead to Virgin Orbit to carry out space launches from Spaceport Cornwall. This will represent the first satellite launch from European soil.
This article was posted on Jan 5, 2023NIST and AIM Photonics hook up on R&D
The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has entered into an R&D cooperation research with AIM Photonics that will give chip developers a critical new tool for designing both opto and electrical iCs
This article was posted on Jan 5, 2023$145m for BCI startup
Synchron, which has developed an implantable brain-computer interface (BCI) device – has picked up a $75 billion investment from Jeff Bezos to add to investments from Bill Gates and VC Vinod Khosla.
This article was posted on Jan 5, 2023Micron draws in its horns
Micron says it will reduce its workforce by 10% in the course of next year.
This article was posted on Jan 5, 2023Knowles debuts balanced armature receivers for OTC hearing aids
Knowles has launched a trio of balanced armature receivers and two MEMS microphones to accelerate the production of over-the-counter OTC hearing aids.
This article was posted on Jan 5, 2023Precision medium bandwidth signal chain connects multiple sensors
ADI has introduced a precision medium bandwidth signal chain platform improving system performance for signal bandwidths of DC to approximately 500kHz towards industrial and instrumentation applications.
This article was posted on Jan 5, 2023