Aries Electronics, Inc. 08-1518-11

08-1518-11 picture photo
Mfg. Part Number
08-1518-11
Manufacturer
Product Category
Sockets for ICs, Transistors
Brief Description
CONN IC DIP SOCKET 8POS GOLD
Datasheet Download
08-1518-11.pdf
Availability of 08-1518-11

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 1.21505
Our Price
Quote by Email

QUANTITY

 

EIS Components is the stocking Distributor of 08-1518-11, we specialize in Aries Electronics, Inc. all series electronic components. 08-1518-11 can be shipped within 24 hours after order. If you have any demands for 08-1518-11, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
08-1518-11 Order Process
Add Parts to RFQ form
Submit RFQ
We reply within 24 hours
You confirm order
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Ship out your order
Specifications of 08-1518-11
Internal Part NumberEIS-08-1518-11
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Standard Package1
Category Connectors, Interconnects
FamilySockets for ICs, Transistors
Series518
PackagingBulk
TypeDIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)8 (2 x 4)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating3A
Contact Resistance-
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)08-1518-11
Related Links08-15, 08-1518-11 Datasheet, Aries Electronics, Inc. Distributor
08-1518-11 Details Description
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