Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-71V65703S75BQ8 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 2,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous ZBT | |
| Memory Size | 9M (256K x 36) | |
| Speed | 7.5ns | |
| Interface | Parallel | |
| Voltage - Supply | 3.135 V ~ 3.465 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 165-TBGA | |
| Supplier Device Package | 165-CABGA (13x15) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 71V65703S75BQ8 | |
| Related Links | 71V6570, 71V65703S75BQ8 Datasheet, Integrated Device Technology (IDT) Distributor | |
![]() | MAX397CPI | IC MUX DUAL ANLG CMOS 28-DIP | datasheet.pdf | |
![]() | D7G-BD | WAFER SW SP-11POS SHORTING | datasheet.pdf | |
![]() | GBM44DSUI | CONN EDGECARD 88POS DIP .156 SLD | datasheet.pdf | |
![]() | GSM43DSUH | CONN EDGECARD 86POS DIP .156 SLD | datasheet.pdf | |
![]() | PIC18F87J93T-I/PT | IC MCU 8BIT 128KB FLASH 80TQFP | datasheet.pdf | |
![]() | 8W-36.000MBA-T | OSC XO 36.000MHZ CMOS SMD | datasheet.pdf | |
![]() | 1676145-1 | RES SMD 102 OHM 0.1% 1/10W 0805 | datasheet.pdf | |
![]() | SP3073EEN-L | IC TXRX RS485/RS422 ESD 14NSOIC | datasheet.pdf | |
![]() | 8N3SV76EC-0024CDI | IC OSC VCXO 100MHZ 6-CLCC | datasheet.pdf | |
![]() | 1720288 | HEADER | datasheet.pdf | |
![]() | 1824492 | CONN TERM BLOCK | datasheet.pdf | |
![]() | ECA30DCSS | CONN EDGECARD 60POS .125" | datasheet.pdf |