Ship from: HONGKONG
								Date Code: Newest Date Code
								Manufacturer lead time 6 weeks
| Internal Part Number | EIS-76151-003LF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 5,000 | |
| Category | Connectors, Interconnects | |
| Family | Terminals - PC Pin, Single Post Connectors | |
| Series | Bergpin® | |
| Packaging | Bulk | |
| Terminal Type | Single Post | |
| Terminal Style | Pin Retention | |
| Pin Size - Above Flange | 0.025" (0.64mm) Square | |
| Pin Size - Below Flange | 0.025" (0.64mm) Square | |
| Length Above Flange | - | |
| Length Below Flange | - | |
| Length - Overall | 0.460" (11.68mm) | |
| Flange Diameter | - | |
| Mounting Hole Diameter | 0.032" ~ 0.034" (0.81mm ~ 0.86mm) | |
| Mounting Type | Through Hole | |
| Termination | Solder | |
| Insulation | Non-Insulated | |
| Board Thickness | 0.062" ~ 0.125" (1.57mm ~ 3.18mm) | |
| Contact Material | Phosphor Bronze | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Material - Insulation | - | |
| Insulation Color | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 76151-003LF | |
| Related Links | 76151, 76151-003LF Datasheet, FFF Distributor | |
|  | 43F125 | RES 125 OHM 3W 1% AXIAL | datasheet.pdf | |
|  | HSCMAND015PA2A3 | SENSOR PRES 15PSI ABSO 3.3V SMD | datasheet.pdf | |
|  | VI-JW1-CY-F2 | CONVERTER MOD DC/DC 12V 50W | datasheet.pdf | |
|  | 5800-821-RC | FIXED IND 820UH 200MA 1.96 OHM | datasheet.pdf | |
|  | 4114R-2-562 | RES ARRAY 13 RES 5.6K OHM 14DIP | datasheet.pdf | |
|  | 71BF36-03-2-02S | SWITCH ROTARY | datasheet.pdf | |
|  | 85706-1211LF | CABLE CONNECTOR | datasheet.pdf | |
|  | 10AX115N2F40I2SGES | IC FPGA 624 I/O 1517FCBGA | datasheet.pdf | |
|  | ATS-17G-162-C3-R0 | HEATSINK 45X45X25MM L-TAB T412 | datasheet.pdf | |
|  | ATS-05E-36-C3-R0 | HEATSINK 36.83X57.6X11.43MM T412 | datasheet.pdf | |
|  | RM46L840ZWTT | IC MCU ARM 1.25MB FLASH 337NFBGA | datasheet.pdf | |
|  | BML1SSL18W | CONN STRAIN RELIEF EMI/RFI STR | datasheet.pdf |