Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-87139-006LF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 8,000 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular Connectors - Headers, Male Pins | |
| Series | Minitek™ MezzSelect™, Basics+ | |
| Packaging | Bulk | |
| Contact Type | Male Pin | |
| Connector Type | Header, Shrouded | |
| Number of Positions | 6 | |
| Number of Positions Loaded | All | |
| Pitch | 0.079" (2.00mm) | |
| Number of Rows | 2 | |
| Row Spacing | 0.079" (2.00mm) | |
| Contact Mating Length | - | |
| Mounting Type | Through Hole | |
| Termination | Solder | |
| Fastening Type | - | |
| Features | - | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 8µin (0.20µm) | |
| Color | Black | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 87139-006LF | |
| Related Links | 87139, 87139-006LF Datasheet, FFF Distributor | |
![]() | ALSR0112R00FE12 | RES 12 OHM 1W 1% AXIAL | datasheet.pdf | |
| DS2764AE+T&R | IC MON BATT LI-ION HP 16-TSSOP | datasheet.pdf | ||
![]() | H3AAS-3418M | IDC CABLE - HSC34S/AE34M/HSC34S | datasheet.pdf | |
![]() | RG3216P-3833-W-T1 | RES SMD 383K OHM 0.05% 1/4W 1206 | datasheet.pdf | |
![]() | MC10H186L | IC D-TYPE POS TRG SNGL 16CDIP | datasheet.pdf | |
![]() | CNY17F3VM | OPTOISOLATOR 7.5KV TRANS 6-DIP | datasheet.pdf | |
![]() | 2-1879279-6 | RES SMD 75K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | UPL1-1REC4-1643-420 | CIRCUIT BREAKER MAG-HYDR LEVER | datasheet.pdf | |
![]() | V300C2C50BS | CONVERTER MOD DC/DC 2V 50W | datasheet.pdf | |
![]() | ATS-10D-50-C1-R0 | HEATSINK 30X30X15MM L-TAB | datasheet.pdf | |
![]() | T37058-19-0 | Connector Barrier Block Strip 19 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | EP7312-ER-C | HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |