Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-89H10T4BG2ZBBCGI | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
Standard Package | 84 | |
Category | Integrated Circuits (ICs) | |
Family | Interface - Specialized | |
Series | * | |
Packaging | Tray | |
Applications | Switch Interfacing | |
Interface | PCI Express | |
Voltage - Supply | 3.3V | |
Package / Case | 324-LFBGA | |
Supplier Device Package | 324-CABGA (19x19) | |
Mounting Type | Surface Mount | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 89H10T4BG2ZBBCGI | |
Related Links | 89H10T4B, 89H10T4BG2ZBBCGI Datasheet, Integrated Device Technology (IDT) Distributor |
![]() | MC68HC908JB16JDW | IC MCU 8BIT 16KB FLASH 20SOIC | datasheet.pdf | |
![]() | 85108EC1412P50 | CONN PLUG 12POS R/A W/PINS | datasheet.pdf | |
![]() | 4416P-2-221 | RES ARRAY 15 RES 220 OHM 16SOIC | datasheet.pdf | |
![]() | GCM0335C1E4R5CD03D | CAP CER 4.5PF 25V NP0 0201 | datasheet.pdf | |
![]() | LFE2M50E-6F900I | IC FPGA 410 I/O 900BGA | datasheet.pdf | |
![]() | 0191310036 | BLOCK SPADE INSULKRIMP | datasheet.pdf | |
![]() | RNC55H2402DSBSL | RES 24K OHM 1/8W .5% AXIAL | datasheet.pdf | |
![]() | RNC55H9881BSR36 | RES 9.88K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | MCR18ERTF1603 | RES SMD 160K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | 830-80-003-40-001191 | CONN HDR 3POS 2MM SMD R/A | datasheet.pdf | |
![]() | ATS-11A-27-C2-R0 | HEATSINK 70X70X12.7MM XCUT T766 | datasheet.pdf | |
![]() | AIT1AA16S-1S0 | ER 7C 7#16S SKT RECP | datasheet.pdf |