Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CSD87330Q3D | |
| Lead Free Status / RoHS Status | Contains lead / RoHS compliant by exemption | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | NexFET MOSFET Technology Telecom Point of Load Solutions | |
| PCN Design/Specification | Qualification Revision A 01/Jul/2014 | |
| PCN Assembly/Origin | Qualification Wire Bond 27/May/2014 Assembly/Test Site Transfer 19/Dec/2014 | |
| PCN Packaging | MSL1 Bubble Bag Conversion 24/Sep/2013 | |
| Manufacturer Product Page | CSD87330Q3D Specifications | |
| Standard Package | 1 | |
| Category | Discrete Semiconductor Products | |
| Family | FETs - Arrays | |
| Series | NexFET™ | |
| Packaging | Cut Tape (CT) | |
| FET Type | 2 N-Channel (Half Bridge) | |
| FET Feature | Logic Level Gate | |
| Drain to Source Voltage (Vdss) | 30V | |
| Current - Continuous Drain (Id) @ 25°C | 20A | |
| Rds On (Max) @ Id, Vgs | - | |
| Vgs(th) (Max) @ Id | 2.1V @ 250µA | |
| Gate Charge (Qg) @ Vgs | 5.8nC @ 4.5V | |
| Input Capacitance (Ciss) @ Vds | 900pF @ 15V | |
| Power - Max | 6W | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-LDFN Exposed Pad | |
| Supplier Device Package | 8-SON-EP (3.3x3.3) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CSD87330Q3D | |
| Related Links | CSD87, CSD87330Q3D Datasheet, Texas Instruments Distributor | |
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