Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-D38999/26LE6HN-LC | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors - Housings | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | D38999/26LE6HN-LC | |
Related Links | D38999/2, D38999/26LE6HN-LC Datasheet, Amphenol Aerospace Operations Distributor |
![]() | MAX505BCNG | IC DAC CMOS QUAD 8BIT R-R 24-DIP | datasheet.pdf | |
![]() | RT0402BRD075K11L | RES SMD 5.11KOHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | HBC50DRYI-S13 | CONN EDGECARD 100PS .100 EXTEND | datasheet.pdf | |
![]() | STEVAL-MKI072V1 | BOARD DEMO MEMS LY3100ALH | datasheet.pdf | |
![]() | CA3101F28-22SBF80 | CONN RCPT 6POS INLINE W/SKTS | datasheet.pdf | |
![]() | VI-B1X-MY-F1 | CONVERTER MOD DC/DC 5.2V 50W | datasheet.pdf | |
![]() | 0436500711 | MICROFIT 3.0 SR RA SMT CLIP 30AU | datasheet.pdf | |
![]() | ATB2012E-75011M-T000 | WOUND CHIP BALUN | datasheet.pdf | |
![]() | 924227-28-11-I | CONN HEADER 22POS .100" DL GOLD | datasheet.pdf | |
![]() | SFM210-LPSE-D08-SM-BK | Connector Header, Top or Bottom Entry 16 Position 0.039" (1.00mm) Gold Surface Mount | datasheet.pdf | |
![]() | NS10145T3R3NNV | FIXED IND 3.3UH 6.1A 12 MOHM SMD | datasheet.pdf | |
![]() | 222K121-100/184-0 | MOLDED PARTS | datasheet.pdf |