Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-H2F1.18BK25 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Cables, Wires - Management | |
| Family | Heat Shrink Fabric | |
| Series | Shrinkflex | |
| Shrinkage Ratio | 2 to 1 | |
| Length | 25.0' (7.62m) | |
| Diameter - Inner, Recovered | 0.59" (15.0mm) | |
| Diameter - Inner, Supplied | 1.18" (30.0mm) | |
| Wall Thickness - Nonrecovered | - | |
| Color | Black | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | H2F1.18BK25 | |
| Related Links | H2F1., H2F1.18BK25 Datasheet, Techflex Distributor | |
![]() | 900256.04 | PIN REPLACEMENT 3X12 KT35 | datasheet.pdf | |
![]() | AT27C040-90TU | IC OTP 4MBIT 90NS 32TSOP | datasheet.pdf | |
![]() | GBM10DRTI | CONN EDGECARD 20POS DIP .156 SLD | datasheet.pdf | |
![]() | MAX6717UKRVD3+T | IC SUPERVISOR MPU SOT23-5 | datasheet.pdf | |
![]() | TNPW0805866RBETA | RES SMD 866 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | LPC2930FET208,551 | IC ARM9 MCU FLASHLESS 208-LQFP | datasheet.pdf | |
![]() | MAX16922AUPA/V+ | IC DCDC CONV STPDN LDO 20TSSOP | datasheet.pdf | |
![]() | 3-1879508-2 | RES SMD 21 OHM 1% 1/3W 0805 | datasheet.pdf | |
![]() | RNC55H1503BMRSL | RES 150K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | ATS-20D-109-C3-R1 | HEATSINK 54X40X9.5MM XCUT T412 | datasheet.pdf | |
![]() | YK31206030J0G | Connector Barrier Block Strip 6 Circuit 0.300" (7.62mm) | datasheet.pdf | |
![]() | 4RVG4M08-503VM4X4 | Capacitors Inductors Filters... | datasheet.pdf |