Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LAE3-35EA-6FN672E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ECP3 | |
| Number of LABs/CLBs | 4125 | |
| Number of Logic Elements/Cells | 33000 | |
| Total RAM Bits | 1358848 | |
| Number of I/O | 310 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 672-BBGA | |
| Supplier Device Package | 672-FPBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LAE3-35EA-6FN672E | |
| Related Links | LAE3-35E, LAE3-35EA-6FN672E Datasheet, Lattice Semiconductor Corporation Distributor | |
![]() | 0218.063HXP | FUSE GLASS 63MA 250VAC 5X20MM | datasheet.pdf | |
![]() | CRCW20104M42FKEF | RES SMD 4.42M OHM 1% 3/4W 2010 | datasheet.pdf | |
![]() | RG2012V-6190-B-T5 | RES SMD 619 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | 744775133 | FIXED IND 33UH 1.35A 130 MOHM | datasheet.pdf | |
![]() | RGH1608-2C-P-364-B | RES SMD 360K OHM 0.1% 1/6W 0603 | datasheet.pdf | |
![]() | IDT71V25761SA166BG | IC SRAM 4.5MBIT 166MHZ 119BGA | datasheet.pdf | |
![]() | C0402C101K4GACTU | CAP CER 100PF 16V NP0 0402 | datasheet.pdf | |
![]() | ATS-06A-210-C1-R0 | HEATSINK 70X70X12MM XCUT | datasheet.pdf | |
![]() | ATS-07A-172-C3-R0 | HEATSINK 30X30X25MM R-TAB T412 | datasheet.pdf | |
![]() | 532428-3 | HDI RECP ASSY 2 ROW 40 POS | datasheet.pdf | |
![]() | MS27508E20B35PA-LC | JT 79C 79#22D PIN WALL RECP | datasheet.pdf | |
![]() | TVS01RF-25-35PC | TV 128C 128#22D PIN RECP | datasheet.pdf |