NXP Semiconductors/Freescale Semiconductor, Inc. LPC11E35FHI33/501E
- Mfg. Part Number
- LPC11E35FHI33/501E
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU ARM 32KB FLASH 32HVQFN
- Datasheet Download
- LPC11E35FHI33/501E.pdf
Availability of LPC11E35FHI33/501E
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 2.90451
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of LPC11E35FHI33/501E, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. LPC11E35FHI33/501E can be shipped within 24 hours after order. If you have any demands for LPC11E35FHI33/501E, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- LPC11E35FHI33/501E Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
LPC11E35FHI33/501E
| Internal Part Number | EIS-LPC11E35FHI33/501E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 490 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | LPC11E3x | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M0 | |
| Core Size | 32-Bit | |
| Speed | 50MHz | |
| Connectivity | I²C, Microwire, SmartCard, SPI, SSP, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, WDT | |
| Number of I/O | 26 | |
| Program Memory Size | 64KB (64K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 4K x 8 | |
| RAM Size | 12K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 8x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 32-VFQFN Exposed Pad | |
| Supplier Device Package | 32-HVQFN (5x5) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LPC11E35FHI33/501E | |
| Related Links | LPC11E35F, LPC11E35FHI33/501E Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
LPC11E35FHI33/501E Details Description
Related parts for LPC11E35FHI33/501E
 | 753181223GTR | RES ARRAY 16 RES 22K OHM 18DRT | datasheet.pdf | |
 | A3AAA-1418M | IDC CABLE- ASN14A/ AE14M / ASN14 | datasheet.pdf | |
 | MCS04020C3482FE000 | RES SMD 34.8K OHM 1% 1/10W 0402 | datasheet.pdf | |
| ECC15DRXH-S734 | CONN EDGECARD 30POS DIP .100 SLD | datasheet.pdf | |
| RCC49DRAI-S734 | CONN EDGECARD 98POS .100 R/A PCB | datasheet.pdf | |
.jpg) | 7-1622826-7 | RES SMD 36 OHM 1% 1/16W 0402 | datasheet.pdf | |
 | MC74HC367ADTG | IC BUFFER 3ST HEX 16-TSSOP | datasheet.pdf | |
 | 1-1986712-6 | CONN 5.08MM TERMINAL BLOCK 16POS | datasheet.pdf | |
| 219-3-1REC5-38284-26 | CIRCUIT BREAKER MAG-HYDR LEVER | datasheet.pdf | |
.jpg) | CGA2B2C0G2A221J050BA | CAP CER 220PF 100V C0G 0402 | datasheet.pdf | |
| ATS-01B-154-C2-R0 | HEATSINK 40X40X15MM L-TAB T766 | datasheet.pdf | |
| ATS-14D-208-C3-R0 | HEATSINK 70X70X6MM XCUT T412 | datasheet.pdf |