Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-LPC1857FET256,551 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | LPC1800 Series SPI Flash Interface LPC Cortex-M Microcontrollers | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | Multiple Design Changes 28/Sep/2014 Datasheet Update 18/Apr/2015 | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | LPC18xx | |
Packaging | Tray | |
Core Processor | ARM® Cortex®-M3 | |
Core Size | 32-Bit | |
Speed | 180MHz | |
Connectivity | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | |
Peripherals | Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT | |
Number of I/O | 164 | |
Program Memory Size | 1MB (1M x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | 16K x 8 | |
RAM Size | 136K x 8 | |
Voltage - Supply (Vcc/Vdd) | 2.2 V ~ 3.6 V | |
Data Converters | A/D 8x10b; D/A 1x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 256-LBGA | |
Supplier Device Package | 256-LBGA (17x17) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | LPC1857FET256,551 | |
Related Links | LPC1857F, LPC1857FET256,551 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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