Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2S005S-1FGG484 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion®2 | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 128KB | |
| MCU RAM | 64KB | |
| Peripherals | DDR, PCIe, SERDES | |
| Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
| Speed | 166MHz | |
| Primary Attributes | FPGA - 5K Logic Modules | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Number of I/O | 209 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2S005S-1FGG484 | |
| Related Links | M2S005S, M2S005S-1FGG484 Datasheet, Microsemi SoC Distributor | |
![]() | TNPW12109K10BETA | RES SMD 9.1K OHM 0.1% 1/3W 1210 | datasheet.pdf | |
![]() | ISL9104AIRUWZ-T7A | IC REG BUCK 1.2V 0.5A SYNC 6TDFN | datasheet.pdf | |
![]() | DAMA15PNMBK47F0 | DSUB 15 M CRIMP NM | datasheet.pdf | |
![]() | 0011184185 | 60713-8 CONDUCTOR PUNCH | datasheet.pdf | |
![]() | 0399810302 | TERM BLOCK PLUG 2POS 5.08MM | datasheet.pdf | |
![]() | TNM5-9.5-48-1 | ROUND STANDOFF M5 NYLON 48MM | datasheet.pdf | |
![]() | ESR01MZPJ153 | RES SMD 15K OHM 5% 1/5W 0402 | datasheet.pdf | |
![]() | SBR2A150SP5-13 | DIODE SBR 150V 2A PDI5 | datasheet.pdf | |
| 0855135109 | CONN MOD JACK 8P8C VERT UNSHLD | datasheet.pdf | ||
![]() | 1742136-1 | TAB,118/POKE-IN COMBO,MAG-MATE | datasheet.pdf | |
![]() | FCB-205-AT4 | FCB-205-AT4 | datasheet.pdf | |
![]() | 110990040 | GROVE UNIVERSAL 4 PIN BUCKLED | datasheet.pdf |