Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2S010S-1FG484I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion®2 | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 256KB | |
| MCU RAM | 64KB | |
| Peripherals | DDR, PCIe, SERDES | |
| Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
| Speed | 166MHz | |
| Primary Attributes | FPGA - 10K Logic Modules | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Number of I/O | 233 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2S010S-1FG484I | |
| Related Links | M2S010S, M2S010S-1FG484I Datasheet, Microsemi SoC Distributor | |
![]() | 1230-015A-3L | SENSOR PRES 15PSIA 0-50MV 8-DIP | datasheet.pdf | |
![]() | 74HC7014N,112 | IC BUFF HEX SCHM TRG 14DIP | datasheet.pdf | |
![]() | KTR18EZPJ272 | RES SMD 2.7K OHM 5% 1/4W 1206 | datasheet.pdf | |
![]() | RP15-4812SA/N-HC | CONV DC/DC 15W 36-75VIN 12VOUT | datasheet.pdf | |
![]() | TDESDNY LARGE | GLOVES GRAY/WHITE LARGE 24PC | datasheet.pdf | |
![]() | CDR04BX104AKZRAT | CAP CER 0.1UF 50V 10% BX 1812 | datasheet.pdf | |
![]() | ZUP6-33/LU | PWR SUP BENCH PROG 0-6V 198W | datasheet.pdf | |
![]() | ATS-21D-106-C1-R1 | HEATSINK 45X40X12.7MM XCUT | datasheet.pdf | |
![]() | CIR020R-18-22P-F80 | CONN RCPT 3POS PNL MNT PIN | datasheet.pdf | |
![]() | VJ0805D2R4DXCAP | CAP CER 2.4PF 200V NP0 0805 | datasheet.pdf | |
![]() | 87543-4111CLF | CONN MOD JACK 4P4C | datasheet.pdf |