Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2S010S-1FG484I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion®2 | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 256KB | |
| MCU RAM | 64KB | |
| Peripherals | DDR, PCIe, SERDES | |
| Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
| Speed | 166MHz | |
| Primary Attributes | FPGA - 10K Logic Modules | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Number of I/O | 233 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2S010S-1FG484I | |
| Related Links | M2S010S, M2S010S-1FG484I Datasheet, Microsemi SoC Distributor | |
![]() | 643323-1 | CONN CLIP HEAVEY DUTY BURNER | datasheet.pdf | |
![]() | TNPW201023K2BETF | RES SMD 23.2K OHM 0.1% 0.4W 2010 | datasheet.pdf | |
![]() | GMA.0B.045.DB | BEND RELIEF 4.5MM WHITE | datasheet.pdf | |
![]() | VI-B5Y-IV-F1 | CONVERTER MOD DC/DC 3.3V 99W | datasheet.pdf | |
![]() | 0416720023 | KK 156 HDR ASSY FRLK BKWY 24CKT | datasheet.pdf | |
![]() | VO2601-X016 | OPTOISO 5.3KV OPEN DRAIN 8DIP | datasheet.pdf | |
![]() | 137723609203 | PMI BASE 15/32 NEON T-2 SOLDER | datasheet.pdf | |
![]() | 5451459 | TERM BLOCK PLUG | datasheet.pdf | |
![]() | PC6GRY5S | CAT 6 PATCH CORD 5' GR | datasheet.pdf | |
![]() | TLP2303(TPL,E | OPTOISO 3.75KV TRANS 6-SO 5 LEAD | datasheet.pdf | |
![]() | D38999/26LE35HB | TV 55C 55#22D PIN PLUG | datasheet.pdf | |
![]() | GRM36COG221J50D500 | Capacitors Inductors Filters... | datasheet.pdf |