Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MC9S08PA8VWJ | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Errata Update 12/Nov/2013 Manual/Datasheet/Errata Update 26/Sep/2014 | |
| PCN Assembly/Origin | Fabrication Site Transfer 05/Nov/2014 Assembly Site Addition 05/Mar/2015 | |
| Standard Package | 38 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | S08 | |
| Packaging | Tube | |
| Core Processor | S08 | |
| Core Size | 8-Bit | |
| Speed | 20MHz | |
| Connectivity | I²C, LIN, SPI, UART/USART | |
| Peripherals | LVD, POR, PWM, WDT | |
| Number of I/O | 18 | |
| Program Memory Size | 8KB (8K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 256 x 8 | |
| RAM Size | 2K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 5.5 V | |
| Data Converters | A/D 12x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 105°C | |
| Package / Case | 20-SOIC (0.295", 7.50mm Width) | |
| Supplier Device Package | 20-SOIC W | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC9S08PA8VWJ | |
| Related Links | MC9S08, MC9S08PA8VWJ Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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