Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MC9S08QG4MPAE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | USBSpyder08 Discovery Kit | |
| Design Resources | Development Tool Selector | |
| PCN Obsolescence/ EOL | Multiple Devices 03/Oct/2012 | |
| PCN Design/Specification | Multiple Devices Polyimide Removal 09/Jul/2013 Copper Wire Conversion 20/May/2014 | |
| Standard Package | 2,850 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | S08 | |
| Packaging | Tube | |
| Core Processor | S08 | |
| Core Size | 8-Bit | |
| Speed | 20MHz | |
| Connectivity | I²C, SCI, SPI | |
| Peripherals | LVD, POR, PWM, WDT | |
| Number of I/O | 4 | |
| Program Memory Size | 4KB (4K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 256 x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 4x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 8-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 8-PDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC9S08QG4MPAE | |
| Related Links | MC9S08, MC9S08QG4MPAE Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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