Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP4151-502E/SN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 | |
| PCN Assembly/Origin | SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 100 | |
| Category | Integrated Circuits (ICs) | |
| Family | Data Acquisition - Digital Potentiometers | |
| Series | - | |
| Packaging | Tube | |
| Taper | Linear | |
| Configuration | Potentiometer | |
| Number of Circuits | 1 | |
| Number of Taps | 257 | |
| Resistance (Ohms) | 5k | |
| Interface | SPI | |
| Memory Type | Volatile | |
| Voltage - Supply | 1.8 V ~ 5.5 V | |
| Features | - | |
| Tolerance | - | |
| Temperature Coefficient (Typ) | 150 ppm/°C | |
| Resistance - Wiper (Ohms) (Typ) | 75 | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 8-SOIC N | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP4151-502E/SN | |
| Related Links | MCP4151, MCP4151-502E/SN Datasheet, Microchip Technology Distributor | |
![]() | US681-C00005-015PG | SENSOR 15PSIG 1/4NPT 4-20MA 2' | datasheet.pdf | |
![]() | EEM43DTBS-S189 | CONN EDGECARD 86POS R/A .156 SLD | datasheet.pdf | |
![]() | GTCS28-900M-R20 | GDT 90V 20% 20KA SURFACE MOUNT | datasheet.pdf | |
![]() | 2-1625827-3 | RES SMD 0.004 OHM 1% 1W 2512 | datasheet.pdf | |
![]() | VI-J4V-IX-F2 | CONVERTER MOD DC/DC 5.8V 75W | datasheet.pdf | |
![]() | RNC55H9003DSB14 | RES 900K OHM 1/8W .5% AXIAL | datasheet.pdf | |
![]() | A-TB750-VI11H | TERMINAL BLOCK | datasheet.pdf | |
![]() | ATS-21G-19-C2-R0 | HEATSINK 54X54X20MM XCUT T766 | datasheet.pdf | |
![]() | ATS-18E-144-C2-R0 | HEATSINK 30X30X25MM L-TAB T766 | datasheet.pdf | |
![]() | VJ0402D9R1CLXAJ | CAP CER 9.1PF 25V NP0 0402 | datasheet.pdf | |
![]() | ERA-2ARB163X | RES SMD 16K OHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | XCV600E-FGG77AF | IC FPGA 316 I/O 432MBGA | datasheet.pdf |