Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MKL02Z32CAF4R | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | KINETIS K, L, COLDFIRE+ Errata Update 17/Oct/2013 New Maskset 09/Dec/2013 KL02 Series Datasheet Update 24/Apr/2014 Datasheet Update 16/Sep/2014 | |
| Standard Package | 3,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | Kinetis KL02 | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | ARM® Cortex®-M0+ | |
| Core Size | 32-Bit | |
| Speed | 48MHz | |
| Connectivity | I²C, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
| Number of I/O | 18 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.71 V ~ 3.6 V | |
| Data Converters | A/D 10x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 20-UFBGA, WLCSP | |
| Supplier Device Package | 20-WLCSP (1.99x1.94) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MKL02Z32CAF4R | |
| Related Links | MKL02Z, MKL02Z32CAF4R Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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