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NXP Semiconductors/Freescale Semiconductor, Inc. MPC8313ECZQADDC

MPC8313ECZQADDC picture photo
Mfg. Part Number
MPC8313ECZQADDC
Manufacturer
Product Category
Embedded - Microprocessors
Brief Description
IC MPU MPC83XX 267MHZ 516BGA
Datasheet Download
MPC8313ECZQADDC.pdf
Availability of MPC8313ECZQADDC

Available Quantity

5020 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 24.93238
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of MPC8313ECZQADDC, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. MPC8313ECZQADDC can be shipped within 24 hours after order. If you have any demands for MPC8313ECZQADDC, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
MPC8313ECZQADDC Order Process
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Specifications of MPC8313ECZQADDC
Internal Part NumberEIS-MPC8313ECZQADDC
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
PCN Design/SpecificationErrata Update 18/Jun/2014
MPC8313 Copper Bond Wire 03/Jul/2014
Standard Package40
Category Integrated Circuits (ICs)
FamilyEmbedded - Microprocessors
SeriesMPC83xx
PackagingTray
Core ProcessorPowerPC e300c3
Number of Cores/Bus Width1 Core, 32-Bit
Speed267MHz
Co-Processors/DSPSecurity; SEC 2.2
RAM ControllersDDR, DDR2
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10/100/1000 Mbps (2)
SATA-
USBUSB 2.0 + PHY (1)
Voltage - I/O1.8V, 2.5V, 3.3V
Operating Temperature-40°C ~ 105°C
Security FeaturesCryptography
Package / Case516-BBGA Exposed Pad
Supplier Device Package516-TEPBGA (27x27)
Additional InterfacesDUART, HSSI, I²C, PCI, SPI
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)MPC8313ECZQADDC
Related LinksMPC8313, MPC8313ECZQADDC Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor
MPC8313ECZQADDC Details Description
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