Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC24F32KA302-I/SP | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC24FV32KA304 Errata Datasheet Revision 12/Nov/2013 Copper Bond Wire 07/Apr/2015 Errata/Datasheet Update 10/Aug/2015 | |
| PCN Assembly/Origin | Qualification Copper Wire 22/Apr/2014 Qualification Revision 23/Jun/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 15 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | |
| Number of I/O | 24 | |
| Program Memory Size | 32KB (11K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 512 x 8 | |
| RAM Size | 2K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 13x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 28-SPDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24F32KA302-I/SP | |
| Related Links | PIC24F32K, PIC24F32KA302-I/SP Datasheet, Microchip Technology Distributor | |
![]() | 2306 321 55271 | RES SMD 270 OHM 5% 5W Z BEND | datasheet.pdf | |
![]() | OSTVI122151 | CONN TERM BLOCK 5.08MM 12POS PCB | datasheet.pdf | |
![]() | RMCP2010FT42R2 | RES SMD 42.2 OHM 1% 1W 2010 | datasheet.pdf | |
![]() | BVA15/Z0000/08 | POLYSNAP POWER INLET MODULE | datasheet.pdf | |
![]() | ESR10EZPF11R5 | RES SMD 11.5 OHM 1% 0.4W 0805 | datasheet.pdf | |
![]() | V300B8C200BN3 | CONVERTER MOD DC/DC 8V 200W | datasheet.pdf | |
![]() | 71217-168HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | ATS-05B-152-C3-R0 | HEATSINK 35X35X35MM L-TAB T412 | datasheet.pdf | |
![]() | TO293K-EFAX | 1.3UM DFB IN TO CAN | datasheet.pdf | |
![]() | MS46SR-30-1745-Q1-10X-10R-NC-F | SYSTEM | datasheet.pdf | |
![]() | LLG2Z222MELC35 | CAP ALUM 2200UF 20% 180V SNAP | datasheet.pdf | |
![]() | DSS4N-02P | TOP INSERTION BRIDGE 2 POLE FOR | datasheet.pdf |