Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-RJP020N06T100 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | MOSFETs | |
| Standard Package | 1,000 | |
| Category | Discrete Semiconductor Products | |
| Family | FETs - Single | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| FET Type | MOSFET N-Channel, Metal Oxide | |
| FET Feature | Standard | |
| Drain to Source Voltage (Vdss) | 60V | |
| Current - Continuous Drain (Id) @ 25°C | 2A (Ta) | |
| Rds On (Max) @ Id, Vgs | 240 mOhm @ 2A, 4.5V | |
| Vgs(th) (Max) @ Id | 1.5V @ 1mA | |
| Gate Charge (Qg) @ Vgs | 10nC @ 4V | |
| Input Capacitance (Ciss) @ Vds | 160pF @ 10V | |
| Power - Max | 500mW | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-243AA | |
| Supplier Device Package | MPT3 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | RJP020N06T100 | |
| Related Links | RJP020, RJP020N06T100 Datasheet, Rohm Semiconductor Distributor | |
![]() | TLC2654Q-8D | IC OPAMP GP 1.9MHZ 8SOIC | datasheet.pdf | |
![]() | PI5C3305UEX | IC 2-BIT BUS SWITCH 8-MSOP | datasheet.pdf | |
![]() | 391-012-522-202 | CARDEDGE 12POS DL .100 BLK PCB | datasheet.pdf | |
![]() | RSM15DRYI-S13 | CONN EDGECARD 30POS .156 EXTEND | datasheet.pdf | |
![]() | 82P2816BB | IC LIU T1/J1/E1 16+1CH 416-PBGA | datasheet.pdf | |
![]() | VI-B6N-CY-F3 | CONVERTER MOD DC/DC 18.5V 50W | datasheet.pdf | |
![]() | LP38693SD-1.8 | IC REG LDO 1.8V 0.5A 6WSON | datasheet.pdf | |
![]() | MLBAWT-A1-R250-000VE5 | LED XLAMP NEUTRAL WHT 4000K 4SMD | datasheet.pdf | |
![]() | CGA1A2X7R1E151K030BA | CAP CER 150PF 25V X7R 0201 | datasheet.pdf | |
![]() | 1537R-52J | FIXED IND 33UH 185MA 3 OHM TH | datasheet.pdf | |
![]() | ATS-21G-27-C3-R0 | HEATSINK 70X70X12.7MM XCUT T412 | datasheet.pdf | |
![]() | LDB311G5010C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |