Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-SP2-12-01 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Engineering Technology Injection Molding and Plastics Plastic Materials | |
Standard Package | 1,000 | |
Category | Hardware, Fasteners, Accessories | |
Family | Board Supports | |
Series | SP2 | |
Holding Type | Snap Lock | |
Mounting Type | Snap Lock | |
Between Board Height | 0.750" (19.05mm) 3/4" | |
Length - Overall | 1.065" (27.04mm) | |
Support Hole Diameter | 0.187" (4.75mm) 3/16" | |
Support Panel Thickness | 0.062" (1.57mm) 1/16" | |
Mounting Hole Diameter | 0.187" (4.75mm) 3/16" | |
Mounting Panel Thickness | 0.062" (1.57mm) 1/16" | |
Features | - | |
Material | Nylon | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | SP2-12-01 | |
Related Links | SP2-, SP2-12-01 Datasheet, Essentra Components (formerly Richco, Inc.) Distributor |
![]() | APA501-80-004 | HEATSINK (80) 115X59X22.5MM HORZ | datasheet.pdf | |
![]() | RG2012V-1020-W-T5 | RES SMD 102 OHM 0.05% 1/8W 0805 | datasheet.pdf | |
![]() | EP3C25F324C8N | IC FPGA 215 I/O 324FBGA | datasheet.pdf | |
![]() | VJ1210Y103KBGAT4X | CAP CER 10000PF 1KV X7R 1210 | datasheet.pdf | |
![]() | CY62138FV30LL-45ZSXIT | IC SRAM 2MBIT 45NS 44TSOP | datasheet.pdf | |
![]() | AO6701 | MOSFET P-CH 30V 2.3A 6TSOP | datasheet.pdf | |
![]() | VI-JTX-CZ-F3 | CONVERTER MOD DC/DC 5.2V 25W | datasheet.pdf | |
![]() | CMF601M2700BHRE | RES 1.27M OHM 1W .1% AXIAL | datasheet.pdf | |
![]() | SMA5J12CA-M3/5A | TVS DIODE 12VWM 19.9VC DO-214AC | datasheet.pdf | |
![]() | TP0610T-G | MOSFET P-CH 60V 0.12A SOT23-3 | datasheet.pdf | |
![]() | 5414 | TRANS 2 X 36 YD BULK | datasheet.pdf | |
![]() | LFE5UM-85F-6BG554I | IC FPGA 84KLUT 1.1V 554CABGA IND | datasheet.pdf |