Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TLV272CDGKR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | SOT23, VSSOP Cu Wire 28/Jun/2013 Copper Wire Revision C 24/Sep/2014 LBC3S Process at DL-LIN Water Diameter Chg 12/Nov/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 2,500 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 2 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 2.6 V/µs | |
| Gain Bandwidth Product | 3MHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 1pA | |
| Voltage - Input Offset | 500µV | |
| Current - Supply | 625µA | |
| Current - Output / Channel | 13mA | |
| Voltage - Supply, Single/Dual (±) | 2.7 V ~ 16 V, ±1.35 V ~ 8 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | |
| Supplier Device Package | 8-VSSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TLV272CDGKR | |
| Related Links | TLV27, TLV272CDGKR Datasheet, Texas Instruments Distributor | |
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