Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-W25Q64DWSFIG | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 44 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | SpiFlash® | |
| Packaging | Tube | |
| Format - Memory | FLASH | |
| Memory Type | FLASH | |
| Memory Size | 64M (8M x 8) | |
| Speed | 104MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 1.7 V ~ 1.95 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 16-SOIC (0.295", 7.50mm Width) | |
| Supplier Device Package | 16-SOIC | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | W25Q64DWSFIG | |
| Related Links | W25Q64, W25Q64DWSFIG Datasheet, Winbond Electronics Corp. Distributor | |
![]() | LD29300D2M15R | IC REG LDO 1.5V 3A D2PAK | datasheet.pdf | |
![]() | RG2012V-3571-B-T1 | RES SMD 3.57K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | NB2308AC1HDTG | IC BUFFER CLK 8OUT 3.3V 16-TSSOP | datasheet.pdf | |
![]() | B82466G103M | FIXED IND 10UH 360MA 900 MOHM | datasheet.pdf | |
![]() | PLT0603Z3320LBTS | RES SMD 332 OHM 0.01% 0.15W 0603 | datasheet.pdf | |
![]() | RNC55J8352BSBSL | RES 83.5K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | MS27466T11B5SB-LC | CONN HSG RCPT FLANGE 5POS SKT | datasheet.pdf | |
![]() | CMF55909K00FKRE70 | RES 909K OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | H11B1-X001 | OPTOISO 5.3KV DARL W/BASE 6DIP | datasheet.pdf | |
![]() | ACC22HETS | CONN EDGE .100 22POS HL LOW P | datasheet.pdf | |
![]() | APL111-1REC4-52-303-AM | CIRCUIT BRKR MAG-HYDR LEVER 30A | datasheet.pdf | |
![]() | 416F50033AKT | CRYSTAL 50.000 MHZ 8PF SMT | datasheet.pdf |