Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-WD2RE02GX818-667G-PQ | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 10 | |
| Category | Memory Cards, Modules | |
| Family | Memory - Modules | |
| Series | - | |
| Memory Type | DDR2 SDRAM | |
| Memory Size | 2GB | |
| Speed | 667MHz | |
| Package / Case | 240-DIMM | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | WD2RE02GX818-667G-PQ | |
| Related Links | WD2RE02GX8, WD2RE02GX818-667G-PQ Datasheet, Wintec Industries Distributor | |
![]() | TXD2SA-L-24V-X | RELAY GEN PURPOSE DPDT 2A 24V | datasheet.pdf | |
![]() | 87023-605 | CONN RECPT 10POS .050" SMT DUAL | datasheet.pdf | |
![]() | 950450-6102-AR | Connector Receptacle 50 Position 0.079" (2.00mm) Gold Through Hole | datasheet.pdf | |
![]() | 70V27S55PF | IC SRAM 512KBIT 55NS 100TQFP | datasheet.pdf | |
![]() | 3001 00020218 | THERMOSTAT 3001 SER NON-HERMETIC | datasheet.pdf | |
![]() | 09661136602 | D-Sub Connector Receptacle, Female Sockets 9 Position Through Hole, Right Angle Solder | datasheet.pdf | |
![]() | 68405-122HLF | HEADER BERGSTIK R/A | datasheet.pdf | |
![]() | ATS-03B-157-C3-R0 | HEATSINK 40X40X30MM L-TAB T412 | datasheet.pdf | |
![]() | ATS-03D-98-C1-R0 | HEATSINK 45X45X15MM R-TAB | datasheet.pdf | |
![]() | 416F380XXCAT | CRYSTAL 38.000 MHZ 10PF SMT | datasheet.pdf | |
![]() | 416F48011ADT | CRYSTAL 48.000 MHZ 18PF SMT | datasheet.pdf | |
![]() | LQH3N221K04M00-01 | Capacitors Inductors Filters... | datasheet.pdf |