Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6SLX150-L1FG900C | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 27 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan® 6 LX | |
| Number of LABs/CLBs | 11519 | |
| Number of Logic Elements/Cells | 147443 | |
| Total RAM Bits | 4939776 | |
| Number of I/O | 576 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 900-BBGA | |
| Supplier Device Package | 900-FBGA (31x31) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6SLX150-L1FG900C | |
| Related Links | XC6SLX150, XC6SLX150-L1FG900C Datasheet, Xilinx Distributor | |
![]() | ADM6316BX46ARJZ-R7 | IC SUPERVISOR WATCHDOG SOT23-5 | datasheet.pdf | |
![]() | NT1 | TIP SOLDER MICRO DIM .01" .291"L | datasheet.pdf | |
![]() | SY55853UKI | IC LATCH D 2.5GHZ 10-MSOP | datasheet.pdf | |
![]() | EXB-24V130JX | RES ARRAY 2 RES 13 OHM 0404 | datasheet.pdf | |
![]() | VE-B3R-CU | CONVERTER MOD DC/DC 7.5V 200W | datasheet.pdf | |
![]() | TPSE337M006R0150 | CAP TANT 330UF 6.3V 20% 2917 | datasheet.pdf | |
![]() | 6282-4SG-311 | CONN PLUG 4POS INLINE SKT | datasheet.pdf | |
![]() | 17004 | JUMBO UTILITY HOOK 1HOOK 4STRIPS | datasheet.pdf | |
![]() | CD214C-R3200 | DIODE GEN PURP 200V 3A SMC | datasheet.pdf | |
| ILD1-X009T | OPTOISO 5.3KV 2CH TRANS 8SMD | datasheet.pdf | ||
![]() | 0385490801 | SOCKET SB S3 5414 SP ASSY | datasheet.pdf | |
![]() | LT3061HDCB#TRMPBF | IC REG LDO ADJ 0.1A 8DFN | datasheet.pdf |