Video: Lee Harrison explains the technology behind, full In-System ATPG testing for advanced semiconductors
Watch the video below, where Lee Harrison – Director of Automotive IC Solutions at Siemens EDA – explains the technology behind full In-System ATPG testing for advanced semiconductors
This article was posted on Mar 12, 2025Women Leaders in Electronics Awards finalists announced
The finalists for the Electronics Weekly Women Leaders in Electronics Awards 2025 have been announced, celebrating their contribution to the electronics industry.
This article was posted on Mar 12, 2025Design Challenge from Element14 and TDK
Q4 NAND ASPs fell 4% QoQ with bit shipments down 2% and revenues down 6.2% to $16.52bn, says TrendForce.
This article was posted on Mar 12, 2025Q4 NAND revenues down 6.2%
Q4 NAND ASPs fell 4% QoQ with bit shipments down 2% and revenues down 6.2% to $16.52bn, says TrendForce.
This article was posted on Mar 12, 2025Design Challenge from Element14 and TDK
Element 14 and TDK have launched a design challenge, inviting engineers, makers, and technology enthusiasts to develop projects utilising TDK’s waterproof ultrasonic range sensors.
This article was posted on Mar 12, 2025Apply for ChipStart UK incubator
Applications are now open for the third cohort of ChipStart UK, the government funded early-stage semiconductor incubator.
This article was posted on Mar 3, 2025Lumotive raises $45m Series B
Lumotive, the programmable optical semiconductor specialist, has closed a $45 million Series B funding round to accelerate sales growth of its Light Control Metasurface (LCM) technology.
This article was posted on Mar 3, 2025Ex-Intel team raise $21.5m to pursue RISC-V for AI
A group of ex-Intel engineers and execs, who founded a RISC-V startup called AheadComputing last year, have raised $21.5 million in seed money, reports Reuter’s.
This article was posted on Mar 3, 2025EW BrightSparks 2024 profile: Hazel Pumphrey, University of Nottingham
Now in its seventh year, the EW BrightSparks awards see Electronics Weekly highlight and celebrate some of the brightest and most talented young engineers in the UK today.
This article was posted on Mar 3, 2025ISSCC: 30MHz bio-impedance IC and implantable ultrasonic network
University College London revealed a 30MHz impedance spectroscopy IC for analysing biological samples at ISSCC in San Francisco this week.
This article was posted on Mar 3, 2025ISSCC: Lightweight actuator for micro-drones
University of California San Diego and French lab CEA-Leti have got together to create a novel high-voltage drive for electrostatic and piezoelectric actuators in mini-drones, describing the technique at ISSCC in San Francisco this week.
This article was posted on Mar 3, 2025Farnell expands MRO range
Farnell has expanded its industrial and maintenance, repair and operations (MRO) offerings with new partnerships including Airotronics, Dwyer, Endress+Hauser, Pickering, Peltec, Siemens, SICK, Trimax, and TKD Kabel.
This article was posted on Mar 3, 2025Mobile Core Network market falls again
The 2024 Mobile Core Network (MCN) fell 4% y-o-y helped by a 15% decline in the China market for 4Q 2024, says Dell’Oro.
This article was posted on Mar 3, 2025EC awards €1bn European Chips Act money for Infineon’s Dresden fab
Infineon has got EC approval for European Chips Act funding for its Dresden fsb.
This article was posted on Mar 3, 2025Embedded World: Percepio Detect seeks observability of embedded systems
Percepio, the Swedish maker of Tracealyzer, has released Percepio Detect, a tool to increase observability of embedded code and Edge devices during system testing.
This article was posted on Mar 3, 2025NAND still over-supplied
The Q1 NAND market remains over-supplied leading to sustained price declines and financial strain for suppliers, says TrendForce, but supply and demand will be closer to balance in Q2.
This article was posted on Feb 27, 2025VTT awarded €29m for packaging development
The VTT Technical Research Centre of Finland has been awarded €29 million of EU Chips Act money for chip packaging development under the EU APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) pilot line project.
This article was posted on Feb 27, 2025ISSCC: Class-D audio amplifier voltage-boosts its own output
ISSCC, the International Solid-state circuits conference, is the IEEE’s annual showcase for all that is best in on-chip circuit design from across the globe.
This article was posted on Feb 27, 2025Cambridge GaN Devices completes $32m Series C
British Patient Capital, a commercial subsidiary of the British Business Bank, has made a £5m investment into Cambridge GaN Devices (CGD) as part of a $32 million Series C funding round.
This article was posted on Feb 27, 2025ISSCC: CPUs and image processors
The IEEE’s International Solid-State Circuit Conference in San Francisco featured an overview of next-generation high-performance CPUs.
This article was posted on Feb 27, 2025Sponsored Content: About Supercapacitors and Eaton Electronics’ Offerings
Supercapacitors are essential in energy harvesting, processing, and storage systems across various applications. As technology advances, supercapacitors are increasingly used in renewable energy, IoT devices, and more.
This article was posted on Feb 27, 2025