Nexperia starts IGBT production, starting at 600V

Nexperia has entered the IGBT market, with a 600V 30A device, to be followed by 40, 50 and 75A types.

This article was posted on Jul 14, 2023

Vodafone and Sandbox hook up for quantum-safe networks

Vodafone and SandboxAQ (a spin-off from Alphabet) have conducted a proof-of-concept test for a quantum safe VPN.

This article was posted on Jul 14, 2023

Northumbria Uni, Lockheed Martin detect nanojets with ML algorithms

Northumbria University is collaborating with Lockheed Martin for research into the role played by ‘nanojets’ and the reconnection of the Sun’s magnetic field lines for generating the Solar Corona’s heat.

This article was posted on Jul 14, 2023

Powerchip looking at Japanese fab

SBI Holdings, a financial services group based in Tokyo, is to help Taiwan’s Powerchip Semiconductor Corporation (PSC) to set up a trailing edge foundry and advanced IC R&D centre in Japan.

This article was posted on Jul 14, 2023

WiFi 6/6E to take 58% of the WiFi market this year

Wi-Fi 6 and 6E are expected to overtake Wi-Fi 5 to become the mainstream WiFi technology in 2022, with a market share of 58%, says TrendForce.

This article was posted on Jul 14, 2023

Leonardo to develop Nasa’s infrared sensors to find habitable planets

NASA has awarded a $4m contract to the University of Hawaii to develop – in collaboration with Leonardo, Markury Scientific, and Hawaii Aerospace – ultra-sensitive infrared sensors to help observe distant planets and their atmospheres.

This article was posted on Jul 14, 2023

Dutch government restricts ASML DUV exports

Today the Dutch government has published new regulations regarding export controls of semiconductor equipment, reports ASML.

This article was posted on Jul 10, 2023

Farnell signs global distribution agreement with Seeed Studio

Farnell has signed a deal to distribute Seeed Studio products.

This article was posted on Jul 10, 2023

Software converts STM32G0 MCU to UCSI USB Type-C PPM

STMicroelectronics has released software to make its STM32G0 32bit Cortex-M0+ microcontroller into a UCSI ‘platform policy manager’ (PPM) to manage USB Type-C connectors – in particular for its STM32MP135F-DK development board.

This article was posted on Jul 10, 2023

Binder extends 707 series with M5 angled panel mount connectors

Binder is adding to its 707 product series with new M5 angled panel mount parts, which are aimed space-critical applications.

This article was posted on Jul 10, 2023

China coming for European car market

China is going after the European car market with its NEVs, says TrendForce, which predicts that the market share of Chinese car brands in Western Europe’s NEV market will rise from 6% in 2022 to an 9% this year.

This article was posted on Jul 10, 2023

Imec and ASML deepen collaboration on High-NA EUV

Imec and ASML are to intensify their collaboration in the next phase of developing a High-NA EUV lithography pilot line at imec.

This article was posted on Jul 10, 2023

Power tool eval board from ST and Wurth

Würth Elektronik and STMicroelectronics are demonstrating a brushless dc motor power tool power circuit developed between them.

This article was posted on Jul 10, 2023

Supercapacitor modules at 9, 18 and 30V

Cornell Dubilier has introduced supercapacitor modules for use at 9, 18 or 30V.

This article was posted on Jul 10, 2023

Adhesive for motor magnets can be fixed with light

Delo has created a high-temperature adhesive for electric motor components.

This article was posted on Jul 10, 2023

Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer

The former Samsung executive accused of trying to set up a chip factory in China based on plans stolen from Samsung has been revealed by Korean prosecutors to be Choi Jinseog who has been in jail in Korea since May.

This article was posted on Jul 5, 2023

Nordic launches highly integrated PMIC

Nordic Semiconductor has launched a PMIC with two buck converters, two LDOs and integrated battery charging.

This article was posted on Jul 5, 2023

Picocom O-RAN baseband processor in 4G+5G small cell unit

Picocom, the 5G Open RAN baseband semiconductor and software specialist, and Kiwi Communications Technology (KiwiCT) are showcasing the first fully functional 4G+5G dual mode small cell product at MWC Shanghai 2023. The DYND-6100 small cell unit, designed by KiwiCT, is powered by Picocom’s PC802 PHY SoC for 5GNR/LTE small cells.

This article was posted on Jul 5, 2023

Novocomms funding round boosts UK antenna design

Novocomms, the UK antenna design specialist, is expanding its operations in Birmingham following a successful “multi-million pound” funding round.

This article was posted on Jul 5, 2023

Safran, Terran sign MOA for U.S. satellite electric propulsion system

Safran Electronics & Defense and Terran Orbital have signed a Memorandum of Agreement to study the production of a new electric propulsion system – based on Safran’s PPSX00 plasma thruster – for LEO satellites.

This article was posted on Jul 5, 2023

AEC-qualified MEMS microphone

For ANC (Active Noise Cancellation) systems with an analogue interface, Infineon is expanding its automotive microphone portfolio with the XENSIV MEMS microphone IM68A130A with a flat frequency response to frequencies below 10Hz.

This article was posted on Jul 5, 2023