RS to distribute parts from CUI Devices
CUI Devices has signed a distribution agreement with RS Components.
This article was posted on Jun 28, 2023Low-spiking 100/80V mosfet range gets 8x8mm packaging
Nexperia has added an 8x8mm package option, and a second 5x6mm option, to its ‘NextPower’ mosfet range which is designed to decrease spiking when switching to reduce EMI.
This article was posted on Jun 28, 2023Intel to put $25bn into Israel fab
Hard on the heels of Intel’s announcements last week of a revived €20 billion two-fab deal in Germany and a €4.6 billion assembly and test plant in Poland, comes a $25 billion fab investment in Israel.
This article was posted on Jun 27, 2023Rohm signs $1bn silicon carbide supply deal with Vitesco
Motor inverter maker Vitesco Technologies has signed a silicon carbide component supply deal with Rohm “worth over one billion US dollars until 2030”, according to the companies.
This article was posted on Jun 27, 2023Samsung embraces DIY phone repair in Europe and the UK
Samsung is set to extended its ‘Self-Repair’ programme for phones to Europe, having launched it in the US last year and recently taken it to Korea.
This article was posted on Jun 27, 2023CEA-Leti and Intel put 2D materials on 300mm wafers for nano-sheet transistors
Intel is to team up with French lab CEA-Leti to put two-dimensional transition-metal dichalcogenides on 300mm wafers.
This article was posted on Jun 27, 2023Europe seeks better lithium-sulphur batteries
Persuading lithium-sulphur batteries to heal themselves is the aim of a European project which includes two UK institutions.
This article was posted on Jun 27, 2023pSemi claims lowest noise figure for dual-channel switch modules
pSemi, the Murata subsidiary, is sampling two multi-chip modules featuring dual-channel switches, the PE53230 for 3.3–3.8 GHz and the PE53231 for 3.5–4.0 GHz. Production is scheduled for Q1 2024.
This article was posted on Jun 27, 2023Further decline for PC this year
2023 PC and Tablet shipments are expected to be 15.2% down y-o-y at 384,4 million units, says IDC.
This article was posted on Jun 27, 2023Kuva Space eyes hyperspectral data services Copernicus contract
Kuva Space, a Finnish Earth observation company, has won a five-year contract worth €5m to be the sole provider of hyperspectral data services for the European Commission’s Copernicus Contributing Missions program.
This article was posted on Jun 27, 2023InGa HBT power amplifiers for 5G infrastructure
Guerrilla RF has brought out a series of ¼ W linear InGa HBT power amplifiers for 5G infrastructure.
This article was posted on Jun 27, 2023Emerging substrates market growing at 27% CAGR to reach $264m by 2028
The emerging substrates market including GaSb, InSb, bulk GaN, Ga2O3, bulk AlN, and diamond, as well as engineered substrates and templates, valued at $63.6 million in 2022, is expected to grow at a CAGR of 27% from 2022-28 to reach $264 million by 2028, says Yole Developpement.
This article was posted on Jun 27, 2023Nanusens looking to port MEMS-inside-CMOS technology to smaller process nodes
Today, Nanusens, the Paignton supplier of MEMS sensors built inside CMOS, is finalising a Crowdcube fundraise to provide the funds to port its technology to a range of smaller process nodes.
This article was posted on Jun 26, 2023Intel’s German fab subsidy to be upped to €9.9bn
On Monday, Intel is expected to announce that its subsidy from the German government for its Magdeburg fab-site will be increased, reports Handelsblatt.
This article was posted on Jun 26, 2023Intel to build $4.6bn assembly and test plant in Poland
Intel is to build a $4.6 billion assembly and test plant in Poland.
This article was posted on Jun 26, 2023Bulk acoustic wave RF filter foundry spans 1.6GHz to 7GHz, with plans for 20GHz
Akoustis Technologies, a maker of RF bulk acoustic wave (BAW) filters, has launched foundry service making filters for wireless markets including phones, Wi-Fi, military, 5G infrastructure and automotive.
This article was posted on Jun 26, 2023EBV Elektronik signs franchise deal with Nisshinbo
Distributor EBV Elektronik has signed a franchise agreement with analogue, power and microwave component maker Nisshinbo Micro Devices.
This article was posted on Jun 26, 2023Embedded Studio stops overflowing Arm stacks
Segger has added a way to prevent stack overflows to its Embedded Studio for Arm IDE (integrated development environment).
This article was posted on Jun 26, 2023Gadget Book: Connecting to the Internet with Raspberry Pi Pico W
Yesterday I was writing about Bluetooth coming to the Raspberry Pi Pico W and – in the original Raspberry Pi post – I also saw a link to this e-book: Connecting to the Internet with Raspberry Pi Pico W. Very interesting it looks, too.
This article was posted on Jun 26, 2023Datacentre capex to fall 8%
2023 datacentre capex will fall 8% y-o-y with softness in the enterprise IT and hyperscaler markets, says Dell’Oro.
This article was posted on Jun 26, 2023Durham measures optical turbulence in atmosphere for FSO comms networks
Durham University is working with Viasat to better understand atmospheric turbulence in free-space optical (FSO) communications.
This article was posted on Jun 26, 2023