Last year, shipments of semiconductor manufacturing equipment from the U.S. and Japan to China fell for the first time in three years, reports the Nikkei.
This article was posted on Apr 6, 2023Fan-out (FO) packaging revenue is expected to reach $3.8 billion in 2028, with a CAGR 2022-2028 of 12.5%, says Yole Developpement.
This article was posted on Apr 6, 2023IDC expects worldwide shipments of foldable phones, including flip and fold form factors, to grow over 50% to reach 21.4 million units in 2023 compared to the 14.2 million units shipped in 2022.
This article was posted on Apr 6, 2023OneWeb is celebrating the completion of its low Earth orbit (LEO) constellation, following the launch of 36 Airbus OneWeb Satellites using the Indian Space Research Organisation (ISRO) and NewSpace India Limited (NSIL).
This article was posted on Apr 6, 2023Researchers have not yet got the additive manufacturing, or 3D printing, of metals down to a science completely.
This article was posted on Apr 6, 2023Intel is sampling its 144-core Sierra Forest Xeon datacentre processor and plans to mass-produce it in H1 2024.
This article was posted on Apr 6, 2023Open-source licencing needs a re-think in the face of intellectual property abuse, according to open-source advocate Josef Prusa, founder of 3D printer maker Prusa Research (pictured), which publishes full design files for its products.
This article was posted on Apr 6, 2023For Li-ion battery packs up to 25V, STMicroelectronics has introduced an IC for monitoring, balancing and protection, aiming at cordless power tools, back-up energy storage and medical devices.
This article was posted on Apr 6, 2023ETH Zurich has created a yarn whose capacitance varies significantly with the movement of the textile it is woven into.
This article was posted on Apr 4, 2023Nexperia is shipping 80V and 100V application-specific MOSFETs (ASFETs) for hotswap with enhanced safe operating area (SOA) in an 8×8 mm LFPAK88 package.
This article was posted on Apr 4, 2023The U.S. National Reconnaissance Office (NRO), which is responsible for space-based intelligence, has awarded six study contracts around commercial hyperspectral imagery.
This article was posted on Apr 4, 2023Cambridge GaN Devices (CGD) has had its ICeGaN technology endorsed in a paper by Virginia Tech as more reliable and robust than other GaN platforms.
This article was posted on Apr 4, 2023Last Friday, Gordon Moore died in Hawaii at the age of 94.
This article was posted on Apr 4, 2023The Arduino Uno R4 is to have a Renesas RA4M1 32-bit Arm Cortex-M4 microcontroller, and there are “no plans to discontinue the popular Uno R3” , according to Arduino, which estimates that R4 will deliver a 3x performance boost over the 8bit ATmega328P equipped R3.
This article was posted on Apr 4, 2023We caught up with Longsys in Nuremberg at Embedded World 2023 as part of our promotional coverage for the event.
This article was posted on Apr 4, 2023Nanotec has introduced its first linear actuator with a NEMA 6 stepper motor – the flange is only 14mm across.
This article was posted on Apr 4, 2023CSIRO, Australia’s national science agency, has launched AquaWatch Australia, a SatIoT mission which it describes as a world first ground-to-space water quality monitoring system.
This article was posted on Apr 4, 2023Virgin Orbit may be back in business after its failed launch in January following an expected $200 million cash injection from Texas VC Matthew Brown, reports Reuters.
This article was posted on Apr 3, 2023The Toshiba board voted this morning to accept a $15.3 billion offer from a consortium led by JIP (Japan Industrial Partners) to buy the company.
This article was posted on Apr 3, 2023Anglia Components has signed a distribution agreement with GaN-based power management specialist, EPC (Efficient Power Conversion), covering the UK and Ireland.
This article was posted on Apr 3, 2023Premo has releases an integrated wound component package for automotive on-board LLC chargers rated up to 11kW.
This article was posted on Apr 3, 2023