Rapidus picks Hokkaido for $36bn 2nm fab
Earlier today Rapidus, the Japanese government-backed chip company, said it will build a $36.7 billion 2nm logic fab at Chitose City in Hokkaido Prefecture.
This article was posted on Mar 7, 2023‘Get in the boat and row’, Commerce Sec tells US chip industry
By 2030 the US will set up ‘at least’ two semiconductor clusters to produce advanced ICs, said US Commerce Secretary Gina Raimondo (pictured) last week, when outlining plans for spending the $250 billion of Chips and Science Act money.
This article was posted on Mar 7, 2023Rapidus picks Hokkaido for $36bn 2nm fab
Earlier today Rapidus, the Japanese government-backed chip company, said it will build a $36.7 billion 2nm logic fab at Chitose City in Hokkaido Prefecture.
This article was posted on Mar 7, 2023‘Get in the boat and row’, Commerce Sec tells US chip industry
By 2030 the US will set up ‘at least’ two semiconductor clusters to produce advanced ICs, said US Commerce Secretary Gina Raimondo (pictured) last week, when outlining plans for spending the $250 billion of Chips and Science Act money.
This article was posted on Mar 7, 2023Socionext adds PHY IP
Socionext has launched a new high-speed Direct RF data converter PHY IP..
This article was posted on Mar 3, 2023Longer perovskite solar cell life after theoretical search of passivating materals
Perovskite materials show much promise in solar cells as they are as efficient as silicon, but are deposited as thin films that can be coated on glass.
This article was posted on Feb 28, 2023US NIST adopts Ascon algorithms for small device protection
The US National Institute of Standards and Technology (NIST) has chosen Ascon, a group of cryptographic algorithms, to protect data generated by small devices.
This article was posted on Feb 24, 2023UKESF, Apple partner for ‘Girls into Electronics’ programme
The UK Electronics Skills Foundation (UKESF) and Apple are partnering, to support 400 young women gain insight into a career in Electronic Engineering, for the ‘Girls into Electronics’ programme.
This article was posted on Feb 21, 2023Automotive-qualified supercaps
Kyocera has introduced AEC-Q200 qualified supercapacitors for automotive use.
This article was posted on Feb 20, 2023Automotive-qualified supercaps
Kyocera has introduced AEC-Q200 qualified supercapacitors for automotive use.
This article was posted on Feb 20, 2023Automotive-qualified supercaps
Kyocera has introduced AEC-Q200 qualified supercapacitors for automotive use.
This article was posted on Feb 20, 2023Automotive-qualified supercaps
Kyocera has introduced AEC-Q200 qualified supercapacitors for automotive use.
This article was posted on Feb 20, 2023Automotive-qualified supercaps
Kyocera has introduced AEC-Q200 qualified supercapacitors for automotive use.
This article was posted on Feb 20, 2023Automotive-qualified supercaps
Kyocera has introduced AEC-Q200 qualified supercapacitors for automotive use.
This article was posted on Feb 20, 2023DIN rail computers get Raspberry Pi Compute Module 4S
Sfera Labs has added the Raspberry Pi Compute Module 4S (CM4S) to options within its range of DIN rail computers.
This article was posted on Feb 16, 2023Discrete components address I2C bus conundrum
Torsten Siems, of Toshiba Electronics Europe, suggests using discrete optical isolators for cost-effective and flexible transfer in industrial applications.
This article was posted on Feb 16, 2023Elevating simulation to the cloud
Advances in cloud technology can be exploited to simulate, accelerate and optimise design and verify component choices, says Alex Fischer of SimScale.
This article was posted on Feb 16, 2023‘Soft’ skills built a career that navigated Covid
Rebecca Dobson is corporate vice-president, EMEA, Cadence Design Systems, following a career in sales with two UK semiconductor companies. She tells Caroline Hayes about her route into electronics and how she led staff through the pandemic.
This article was posted on Feb 16, 2023Looking back on IoT retrofitting
A collaboration between Würth Elektronik, FEGA & Schmitt and IAV demonstrates how industrial manufacturing equipment can be upgraded and digitised.
This article was posted on Feb 16, 2023Automotive high-side driver handles 100A
It seems to be the week for high and low-side driver announcements, with STMicroelectronics now following on from Toshiba and Rohm.
This article was posted on Feb 16, 2023Farnell signs Piera Systems
Farnell has signed a new distribution agreement with Piera Systems to sell the Intelligent Particle Sensor (“IPS”) family of particle sensors.
This article was posted on Feb 16, 2023