Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-2M805-003-02M9-10SA | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 2M805-003-02M9-10SA | |
| Related Links | 2M805-003, 2M805-003-02M9-10SA Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | ERG-1SJ392A | RES 3.9K OHM 1W 5% AXIAL | datasheet.pdf | |
![]() | SD3812-820-R | FIXED IND 82UH 259MA 2.885 OHM | datasheet.pdf | |
![]() | AYM36DTAH | CONN EDGECARD 72POS R/A .156 SLD | datasheet.pdf | |
![]() | ZW-10-07-G-D-212-106 | CONN BOARD STKR HDR 20POS 2.54MM | datasheet.pdf | |
![]() | VI-B5Z-MU-F4 | CONVERTER MOD DC/DC 2V 80W | datasheet.pdf | |
![]() | B32561J3224K | CAP FILM 0.22UF 10% 250VDC 2DIP | datasheet.pdf | |
![]() | 310000431073 | HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | EP20K400CB652C9 | IC FPGA 488 I/O 652BGA | datasheet.pdf | |
![]() | ATS-09B-88-C1-R0 | HEATSINK 35X35X25MM R-TAB | datasheet.pdf | |
![]() | 1855631-2 | HDM/FA SAPR.110F.180F BENCH K CU | datasheet.pdf | |
![]() | 1426651-6 | HD INDL NON-AMP APPLI | datasheet.pdf | |
![]() | D38999/24JF11SB | CONN HSG RCPT JAM NUT 11POS SKT | datasheet.pdf |