Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCF5275CVM166J | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Obsolescence/ EOL | Multiple Devices 13/Nov/2012 | |
| PCN Design/Specification | MCF5275 Errata Update 01/Oct/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | MCF527x | |
| Packaging | Tray | |
| Core Processor | Coldfire V2 | |
| Core Size | 32-Bit | |
| Speed | 166MHz | |
| Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | |
| Peripherals | DMA, WDT | |
| Number of I/O | 69 | |
| Program Memory Size | - | |
| Program Memory Type | ROMless | |
| EEPROM Size | - | |
| RAM Size | 64K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.4 V ~ 1.6 V | |
| Data Converters | - | |
| Oscillator Type | External | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-MAPBGA | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCF5275CVM166J | |
| Related Links | MCF5275, MCF5275CVM166J Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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