Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XPEHEW-L1-0000-00G50 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Lighting Product Selector | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1,000 | |
| Category | Optoelectronics | |
| Family | LED Lighting - White | |
| Series | XLamp® XP-E HEW | |
| Packaging | Tape & Reel (TR) | |
| Color | White, Cool | |
| CCT (K) | 6200K | |
| Flux @ 85°C, Current - Test | - | |
| Flux @ 25°C, Current - Test | 135 lm (130 lm ~ 139 lm) | |
| Current - Test | 350mA | |
| Voltage - Forward (Vf) (Typ) | 3V | |
| Lumens/Watt @ Current - Test | 129 lm/W | |
| CRI (Color Rendering Index) | 68 (Typ) | |
| Current - Max | 1A | |
| Viewing Angle | 120° | |
| Mounting Type | Surface Mount | |
| Package / Case | 2-SMD, No Lead, Exposed Pad | |
| Thermal Resistance of Package | 6°C/W | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XPEHEW-L1-0000-00G50 | |
| Related Links | XPEHEW-L1-, XPEHEW-L1-0000-00G50 Datasheet, Cree Inc. Distributor | |
![]() | PZC25SBCN | CONN HEADER .100 SINGL R/A 25POS | datasheet.pdf | |
![]() | KMZ41,118 | IC MAGNETIC FIELD SENSOR 8SOIC | datasheet.pdf | |
![]() | MMO62-12IO6 | MODULE AC CTLR 1200V SOT-227B | datasheet.pdf | |
![]() | IXGA12N60BD1 | IGBT 600V 24A 100W TO263AA | datasheet.pdf | |
![]() | B32522C6224K | CAP FILM 0.22UF 10% 400VDC RAD | datasheet.pdf | |
![]() | 3252W-1-102MLF | TRIMMER 1K OHM 0.75W PC PIN | datasheet.pdf | |
![]() | GRM2165C1H300GZ01D | CAP CER 30PF 50V NP0 0805 | datasheet.pdf | |
![]() | VI-J3P-IW-F1 | CONVERTER MOD DC/DC 13.8V 100W | datasheet.pdf | |
![]() | M5-512/160-10YC | IC CPLD 512MC 10NS 208PQFP | datasheet.pdf | |
![]() | 801-87-023-10-216101 | Connector Receptacle 23 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | ATS-03C-179-C3-R0 | HEATSINK 35X35X30MM R-TAB T412 | datasheet.pdf | |
![]() | XCZU9EG-3FFVB1156E | Microprocessor Circuit, CMOS, PBGA1156 IC | datasheet.pdf |