Nexperia USB4 ESD clamp adds only 100fF
Nexperia has managed to achieve 100fF load capacitance in devices designed to protect USB4 signal lines.
This article was posted on Mar 18, 2020£179m government grant awarded for STEM and DTPs
The government has announced forty-one universities will host doctoral training partnerships (DTPs) funded by a £179m investment from the Engineering and Physical Sciences Research Council (EPSRC), part of UK Research and Innovation (UKRI).
This article was posted on Mar 18, 2020Xilinx announces addition to ACAP platform with Versal Premium
Xilinx has announced Versal Premium, the third series in its Versal ACAP portfolio.
This article was posted on Mar 18, 2020Big Bang UK STEM fair cancelled over Covid-19 concerns
The ongoing coronavirus Covid-19 situation in the UK has led Big Bang UK to cancel its annual Young Scientists and Engineers Fair, which was due to take place 11-14 March.
This article was posted on Mar 18, 2020An L-shaped, U-shaped or V-shaped recovery?
Will the recovery be L-shaped, U-shaped or V-shaped?
This article was posted on Mar 18, 2020Farnell’s Raspberry Pi starter Kit
Farnell has launched its exclusive Raspberry Pi Starter Kit – an all-in-one kit for quick-start embedded computing
This article was posted on Mar 18, 2020Q2 Server DRAM and SSD ASPs substantially up
Q2 server DRAM ASPs will be up 20% q-o-q, says TrendForce, while SSD ASPs will increase 10-15%.
This article was posted on Mar 18, 2020Transimpedance amplifiers for 100-800Gbit/s optical comms
Macom has introduced transimpedance amplifiers for optical comms ranging from 100Gbit/s DR1 to 800Gbit/s DR8 and FR8.
This article was posted on Mar 18, 2020Mouser Electronics stocking STM32L5 low-power MCUs
Mouser Electronics is now stocking STM32L5 low-power microcontrollers from STMicroelectronics. The device is based on a Cortex-M33 core with Trustzone hardware-based security.
This article was posted on Mar 18, 2020Nokia uses Intel Xeon processor for cloud-based 5G virtual RAN
Nokia has announced a collaboration with Intel to incorporate the company’s technology, including the Xeon processor, into its 5G radio portfolio.
This article was posted on Mar 17, 2020Dev board flexibly positions small Bluetooth antenna, for wearables
Fractus Antennas is aiming at wearables with a evaluation board for its 7 x 3 x 2mm ‘Duo mXtend’ ‘antenna booster’.
This article was posted on Mar 17, 2020Sondrel CEO completes EW BrightSparks 2020 selection panel
With the EW BrightSparks Selection Day fast approaching, it is good highlight one of the judges who has been a constant supporter – a mainstay of the programme: Graham Curren, the CEO of Sondrel, the IC design specialists.
This article was posted on Mar 17, 2020Chinfa DIN-Rail ac-dc power supplies available at Relec
The DRE480 series from Chinfa operates at 94% efficiency, and is designed for utilisation in space-constrained industrial applications.
This article was posted on Mar 17, 2020Motion-detection ML core saves MCU power consumption
ST is extending the uses of its motion-detection machine-learning core (MLC) technologies into industrial and high-end consumer applications with the LSM6DSRX 6-axis iNEMO inertial measurement units (IMU).
This article was posted on Mar 17, 2020Motion-detection ML core saves MCU power consumption
ST is extending the uses of its motion-detection machine-learning core (MLC) technologies into industrial and high-end consumer applications with the LSM6DSRX 6-axis iNEMO inertial measurement units (IMU).
This article was posted on Mar 17, 2020Stackable DC/DC buck converter
TI has brought out its 40-A SWIFT DC/DC buck converter, offering stackability of up to four ICs.
This article was posted on Mar 17, 2020Infineon gets CFIUS clearance
Infineon has received US clearance for its takeover of Cypress Semiconductor.
This article was posted on Mar 17, 2020When portable batteries get big
Mobile High Power Charger, is a large battery on wheels.
This article was posted on Mar 17, 2020Fab spend to grow 3% in 2020.
Spending on fab equipment will grow by 3% to $57.8 billion this year, says SEMI.
This article was posted on Mar 17, 2020Marvell announces dual 400GbE PHY for high density implementations
Marvell has launched the 88X9121P, a dual 400GbE (gigabit Ethernet) PHY transceiver with 100GbE serial electrical I/O capabilities, designed for secured high-density optical infrastructure.
This article was posted on Mar 17, 2020Kurt Seivers to succeed Rick Clemmer as NXP CEO
Kurt Seivers (pictured) is to take over as NXP’s CEO from Rick Clemmer.
This article was posted on Mar 16, 2020